Inspur Showcases HPC & AI Solutions at SC19

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In this video from SC19, Vangel Bojaxhi from Inspur describes the company’s innovative solutions for HPC & AI. At the show, the company featured a broad array of HPC & AI servers based on x86 and OpenPOWER as well as a new liquid cooling system.

Inspur is a leading provider of data center infrastructure, cloud computing, and AI solutions, ranking among the world’s top 3 server manufacturers. Through engineering and innovation, Inspur delivers cutting-edge computing hardware design and extensive product offerings to address important technology arenas like open computing, cloud data center, AI and deep learning. Performance-optimized and purpose-built, our world-class solutions empower customers to tackle specific workloads and real-world challenges.

At SC19, Inspur showcased new HPC systems with Natural Circulation Evaporative Cooling technology. Inspur combines high-density computing servers with natural circulation evaporative cooling technology, which is more reliable, energy-saving, and easier to deploy than other liquid cooling solutions.

Inspur MX1

Inspur also unveiled the new MX1 AI System, the first OAM AI system that supports different types of AI chips from multiple manufacturers on a single server.

Inspur is committed to promoting the establishment of specifications in the AI industry, and hopes to promote the development of AI chips and technologies through an open and common specification of AI infrastructure. This vision is highly consistent with OCP, the global open computing community. As the cornerstone of the next generation hyperscale accelerated computing platforms, the OAM standard established by the OCP community defines a unified interface for AI accelerators that supports multiple architectures such as ASIC, GPU, and FPGA, and provides innovative designs in physical form factor, power supply, connectors, definition of pins, and system architecture.

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