Good winter morning and best new year’s wishes to you! Here’s a rapid (5:54) rundown of recent news from the HPC-AI sector, including:
– DOE and LLNL lead effort to go ‘beyond’ EUV lithography
– Report: ByteDance pursues chip trade sanction workaround
– Microsoft’s $80B AI infrastructure build-out
– TSMC to ship 2nm chips in 2025
You can find our podcasts at insideHPC’s @HPCpodcast page, on Twitter, on the OrionX.net blog page, on iTunes and Google. Here’s the OrionX.net podcast page, and the RSS feed. We’re also available on Spotify and iTunes.
