TSMC’s new 2nm process fab (credit: TSMC)
TSMC today held a 2 nanometer (2nm) capacity expansion ceremony at the construction site of Fab 22 in the Southern Taiwan Science Park (STSP), bringing together representatives from government as well as construction and supplier partners to mark an important milestone in the expansion of the company’s advanced process capacity.
The company’s 2nm process technology is slated to enter volume production in the second half of 2025, with its expansion plan progressing smoothly, TSMC said. Located at the Southern Taiwan Science Park in Kaohsiung, TSMC held a topping ceremony for the second phase of the fab.
The fab plan for TSMC Fab 22 calls for each phase cleanroom to be twice the size of a standard logic wafer fab, with a total cleanroom area of 280,000 square meters from phase 1 to phase 5. The entire site is expected to create over 20,000 construction jobs and more than 7,000 direct high-tech positions. Alongside the expansion of 2nm capacity, the company’s deployment at Hsinchu Science Park is also progressing as planned, TSMC said.
TSMC Executive Vice President and Co-Chief Operating Officer Y.P. Chyn presided over today’s ceremony, and honored guests at the event included Premier Cho Jung-tai, Kaohsiung City Mayor Chen Chi-mai, Executive Yuan Secretary-General Kung Ming-hsin, Minister of Economic Affairs Kuo Jyh-huei, Vice Minister of Science and Technology Su Chen-kang, Fu Tsu Construction Chairman Cliff Lin, Dacin Construction Chairman Wang Jen-jeng, China Steel Corporation Chairman Chen Jui-Teng, Tung Ho Steel Chairman Henry C. T. Ho, Evergreen Steel Chairman Lin Keng-li, United Integrated Services Chairman Lee Hui-Wen, Marketech International Chairman Margaret Kao, and representatives from construction partners as well as materials and equipment suppliers.
“We thank our colleagues, contractors, suppliers, and government for their long-standing support. Today’s 2nm capacity expansion ceremony holds significant importance for global semiconductor technology development, marking the successful progress of TSMC’s world-leading 2nm process,” TSMC Executive Vice President and Co-Chief Operating Officer Y.P. Chyn said at the ceremony. “It showcases TSMC’s commitment to meeting strong market demand, continuously expanding capacity to support customers. TSMC will keep strengthening its global presence, providing customers with the best technology solutions and manufacturing services to drive technology forwards. Together with our stakeholders, we aim to create more industry milestones, realizing a more innovative and sustainable future.”
Fab 22 reflects TSMC’s commitment to green manufacturing and environmental harmony, the company said. Like all TSMC GIGAFAB facilities in Taiwan, the fab is designed and constructed according to the Taiwan EEWH and U.S. LEED green building certification standards. Fab 22 also plans to actively utilize reclaimed water, drawing water resources from the Nanzih and Qiaotou Reclaimed Water Plants. Additionally, it will use 25 percent renewable energy from the beginning of volume production, aiming to reach 100% renewable energy usage by 2040 and achieve net-zero emissions by 2050.
Compared with the previous generation’s enhanced N3E technology, TSMC’s 2nm-class N2 technology offers a 10-15 percent increase in speed at the same power consumption or 25-30 percent reduction in power consumption at the same speed. When launched, N2 will be the industry’s most advanced logic technology in terms of power, performance, area and transistor structure, according to TSMC.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services.
