Siemens and GlobalFoundries to Collaborate on AI-Driven Chip Manufacturing


With today’s growing adoption in the AI data center of liquid cooling – essential for controlling AI cooling costs and energy usage – minimizing risk includes the use of high-quality connectors. Liquid cooling connectors are crucial ….
Today, every high-performance computing (HPC) workload running globally faces the same crippling issue: Congestion in the network.
Congestion can delay workload completion times for crucial scientific and enterprise workloads, making HPC systems unpredictable and leaving high-cost cluster resources waiting for delayed data to arrive. Despite various brute-force attempts to resolve the congestion issue, the problem has persisted. Until now.
In this paper, Matthew Williams, CTO at Rockport Networks, explains how recent innovations in networking technologies have led to a new network architecture that targets the root causes of HPC network congestion, specifically:
– Why today’s network architectures are not a sustainable approach to HPC workloads
– How HPC workload congestion and latency issues are directly tied to the network architecture
– Why a direct interconnect network architecture minimizes congestion and tail latency
The Data Center Liquid Cooling Market was valued at USD 870 Million in 2024, and is projected to reach USD 10.70 billion by 2030, rising at a CAGR of 51.93%. Liquid cooling solutions are ….
