Duncan, SC (Nov. 9, 2020) — At virtual SC20, held online November 17 -19, Stäubli, a manufacturer of quick-release coupling systems for IT/liquid cooling, will be digitally highlighting the new DAG coupling this year. The DAG range has been designed for perfect integration in installations such as data centers or super computers, combining three major […]
Search Results for: connectors
Thermoplastic Connectors Grow in Popularity Along with Liquid Cooling
September 7, 2019 by
As liquid cooling becomes more and more prevalent, new technology and types of connectors are becoming water cooler topics for those in the data and computing industries. According to a new report from CPC, long-term, leak-free performance in fluid management systems requires robust connectors. And advanced materials are growing the range of available QD options.
Metal or Plastic Liquid Cooling Connectors? What You Should Consider
January 17, 2019 by
With recent advances, high-performance thermoplastic now offers performance that rivals, and in some cases, surpasses their metal counterparts. Design engineers have to take several factors into consideration when trying to choose between metal or plastic quick disconnects. This guest article from CPC takes a look at the differences between metal and plastic liquid cooling connectors, and the benefits and challenges to each.
CPC to Showcase New QD Connectors for HPC Liquid Cooling at SC18
November 9, 2018 by
Today CPC (Colder Products Company) introduced its new PLQ2 high-performance thermoplastic connector. “PLQ Series QDs are among the highest-performing engineered polymer connectors for liquid cooling applications available. They vastly reduce concerns around plastic QD durability and performance,” said Elizabeth Langer, senior design engineer, thermal management. “HPC and data center specifiers and operators can use these plastic QDs with confidence.”
SC23: TOP500 Trends, the AI-HPC Crossover, Chiplet Standardization, the Emergence of UCIe and CXL Advancements
November 29, 2023 by
By Adrian Cockcroft, Partner & Analyst, OrionX Last year the UCIe chiplet standard had just been launched, and since then just about everyone has joined it, about 130 companies. The idea is that to build a complete CPU or GPU you don’t have to put it all on the same chip from the same….
TYAN Adopts New AMD EPYC 8004 Series Chips for Cloud and Edge Server Deployments
September 19, 2023 by
Newark, Calif. – September 18, 2023 – TYAN, a server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, announced availability of new single-socket server platforms supporting AMD EPYC 8004 Series processors. These platforms are built for cloud services and intelligent edge deployments while offering lower operating costs and delivering impressive energy efficiency. […]
Eviden Announces Quantum Application Development Platform
May 11, 2023 by
Paris – May 11, 2023 – Eviden, an Atos business in digital, cloud, big data and security, today launched Qaptiva for quantum application development. Eviden said it is enabling a software and hardware partner ecosystem to use the Qaptiva application development platform for corporate customers to develop quantum applications, and run them in as-a-service or on premises […]
Gartner Recognizes Gupshup.io as Major CPaaS Vendor
April 21, 2023 by
San Francisco/Mumbai, 18 April 2023: Conversational engagement company Gupshup has announced it has been recognized as a Major CPaaS Vendor in the 2023 Gartner Competitive Landscape: Communications Platform as a Service. According to the report, the CPaaS market is evolving beyond APIs to encompass the entire customer journey. Increasingly, customers expect vendors to come to […]
TYAN Announces Systems Powered by 4th Gen AMD EPYC Processors
November 11, 2022 by
Newark, Calif. – November 10, 2022 – TYAN, a server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 9004 Series processor-based server platforms highlighting energy efficiency and performance breakthroughs designed for next generation server architecture for data centers. “Facing the post-COVID economy world, data centers are required to build on more […]
Molex Launches PCIe Cable Connection for Open Compute Project Servers
October 12, 2022 by
LISLE, IL – October 12, 2022 – Molex, a global electronics company, has announced its NearStack PCIe Connector System and Cable Assemblies for next-gen servers. Developed in collaboration with members of the Open Compute Project (OCP), NearStack PCIe replaces traditional paddle-card cable solutions to optimize signal integrity and improve system performance. A feature of NearStack PCIe is […]
