Duncan, SC (Nov. 9, 2020) — At virtual SC20, held online November 17 -19, Stäubli, a manufacturer of quick-release coupling systems for IT/liquid cooling, will be digitally highlighting the new DAG coupling this year. The DAG range has been designed for perfect integration in installations such as data centers or super computers, combining three major […]
Search Results for: connectors
Thermoplastic Connectors Grow in Popularity Along with Liquid Cooling
September 7, 2019 by
As liquid cooling becomes more and more prevalent, new technology and types of connectors are becoming water cooler topics for those in the data and computing industries. According to a new report from CPC, long-term, leak-free performance in fluid management systems requires robust connectors. And advanced materials are growing the range of available QD options.
Metal or Plastic Liquid Cooling Connectors? What You Should Consider
January 17, 2019 by
With recent advances, high-performance thermoplastic now offers performance that rivals, and in some cases, surpasses their metal counterparts. Design engineers have to take several factors into consideration when trying to choose between metal or plastic quick disconnects. This guest article from CPC takes a look at the differences between metal and plastic liquid cooling connectors, and the benefits and challenges to each.
CPC to Showcase New QD Connectors for HPC Liquid Cooling at SC18
November 9, 2018 by
Today CPC (Colder Products Company) introduced its new PLQ2 high-performance thermoplastic connector. “PLQ Series QDs are among the highest-performing engineered polymer connectors for liquid cooling applications available. They vastly reduce concerns around plastic QD durability and performance,” said Elizabeth Langer, senior design engineer, thermal management. “HPC and data center specifiers and operators can use these plastic QDs with confidence.”
Supermicro Launches Rack-Scale Systems with NVIDIA Blackwell
February 5, 2025 by
San Jose, Calif. – February 5, 2025 – Supermicro, Inc. (NASDAQ: SMCI) announced full availability of its AI data center Building Block Solutions accelerated by the NVIDIA Blackwell platform. The Supermicro Building Block portfolio provides the core infrastructure elements necessary to scale Blackwell solutions. The portfolio includes a broad range of air-cooled and liquid-cooled systems […]
Scality Announces All-Flash Object Store for AI
October 30, 2024 by
SAN FRANCISCO – October 30, 2024 – Storage software company Scality today unveiled RING XP, an all-flash configuration of its RING storage software engineered for extreme performance. Scality said RING XP is the fastest object store with microsecond response-time latencies for small object data, making it ideal for AI model training and fine-tuning. The company said RING XP […]
Lenovo Launches ‘100%’ Liquid Cooled Platforms with Nvidia for GenAI
October 15, 2024 by
Lenovo called the 6th generation ThinkSystem N1380 Neptune a “vertical liquid cooling breakthrough” that supports accelerated computing while reducing power consumption by up to 40 percent… Lenovo, of course, has long been active in liquid cooling ….
Supermicro Adds Intel-Based X14 Servers for AI, HPC, Cloud and Edge
September 24, 2024 by
SAN JOSE, Calif., Sept. 24, 2024 — Supermicro today announced GPU, multi-node and rackmount systems to the X14 portfolio, which are based on the Intel Xeon 6900 Series Processors with P-Cores (formerly code named Granite Rapids-AP). The new servers are designed to address the needs of modern data centers, enterprises, and service providers. Joining the efficiency-optimized […]
SC23: TOP500 Trends, the AI-HPC Crossover, Chiplet Standardization, the Emergence of UCIe and CXL Advancements
November 29, 2023 by
By Adrian Cockcroft, Partner & Analyst, OrionX Last year the UCIe chiplet standard had just been launched, and since then just about everyone has joined it, about 130 companies. The idea is that to build a complete CPU or GPU you don’t have to put it all on the same chip from the same….
TYAN Adopts New AMD EPYC 8004 Series Chips for Cloud and Edge Server Deployments
September 19, 2023 by
Newark, Calif. – September 18, 2023 – TYAN, a server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, announced availability of new single-socket server platforms supporting AMD EPYC 8004 Series processors. These platforms are built for cloud services and intelligent edge deployments while offering lower operating costs and delivering impressive energy efficiency. […]
