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With today’s growing adoption in the AI data center of liquid cooling – essential for controlling AI cooling costs and energy usage – minimizing risk includes the use of high-quality connectors. Liquid cooling connectors are crucial ….
This four part report from our friends over at SOSA highlights the challenges and advances when it comes to regulations, relevant use-cases, and emerging technologies taking the mystery out of AI.
HPE today announced additions to its supercomputing portfolio feaguring higher compute density[1], three multi-partner, multi-workload compute blades, unified management software and high-performance interconnect support for converged AI and HPC workloads.
