Industry Perspectives
Dr Keren Bergman previews ISC Keynote on Optical Computing for HPC
In this special guest feature from Scientific Computing World, Dr Keren Bergman, Professor of Electrical Engineering at the School of Engineering and Applied Science, Columbia University discusses her keynote on the development of silicon photonics for HPC ahead of her Tuesday keynote presentation at ISC 2018. "So today we are able to make all the components of photonic links and this includes 50 GHz data modulators, 50 GHz receivers, nanosecond scale switches all kinds of structures and we can do wave division multiplexing into these interconnect structures. The capabilities are just enormous." [Read More...]
White Papers
Enabling Next-Generation Platforms Using Intel’s 3D System-in-Package Technology
This white paper evaluates system requirements for next-generation platforms and explains why conventional solutions may no longer be able to meet these requirements effectively. The paper introduces the heterogeneous 3D system- in-package (SiP) technology featured in Intel Stratix 10 FPGAs and SoCs. This technology enables next-generation platforms by powering higher bandwidth, lower power, a smaller form factor, and increased functionality and fledibility. Stratix 10 FPGAs and SoCs feature 3D SiP-based transceivers across all densities.
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