Dec. 9, 2025: Cornellis Networks and Supermicro have announ ced Supermicro’s FlexTwin server platforms are now validated with Cornelis’ CN5000 networking for AI and HPC clusters. Cornelis’ CN5000 400Gbps networking platform is designed to address communication bottlenecks by providing data movement between servers — a critical factor in large AI and HPC deployments. Supermicro’s FlexTwin […]
Tsavorite Announces Omni Processing Unit for AI Compute – Integrates CPU, GPU and Memory
November 11, 2025 by
AI compute startup Tsavorite Scalable Intelligence, founded by Intel veterans in 2023, today announced its composable, compute architecture. The Omni Processing Unit (OPU) unifies CPU, GPU, memory and scale up/scale out connectivity in a single device, the company said ….
@HPCpodcast: Silicon Photonics – An Update from Prof. Keren Bergman on a Potentially Transformational Technology for Data Center Chips
October 13, 2025 by
In this episode of the @HPCpodcast, sponsored by CoolIT, we catch up with optical I/O expert and repeat guest ….
Ayar Labs Appoints Vivek Gupta Chief Strategy Officer
October 9, 2025 by
SAN JOSE – Oct. 9, 2025 – Ayar Labs, a co-packaged optics (CPO) company, today announced that Vivek Gupta has joined as the company’s first Chief Strategy Officer (CSO). “This is a momentous time for the company, as we scale to commercial production and strengthen customer partnerships,” said Mark Wade, CEO and co-founder of Ayar Labs. […]
OpenLight Raises $34M for AI Data Center Photonics
August 27, 2025 by
SANTA CLARA, Calif., Aug. 26, 2025 — OpenLight, a Photonic Application-Specific Integrated Circuit (PASIC) chip design and manufacturing company, today announced the close of its oversubscribed $34M Series A. The round is co-led by Xora Innovation and Capricorn Investment Group. Other participants include Mayfield; Juniper Networks, now part of HPE; Lam Capital, the corporate venture […]
AMD Licenses Arteris Network-on-Chip Interconnect IP
August 5, 2025 by
CAMPBELL, Calif. – August 4, 2025 – Arteris, Inc. (Nasdaq: AIP), a provider of semiconductor system IP for accelerating system-on-chip (SoC) creation, today announced AMD (Nasdaq: AMD) has licensed FlexGen network-on-chip (NoC) interconnect IP for its next generation of AI chiplet design. FlexGen, Arteris’ NoC IP technology, will provide data transport in AMD chiplets powering AI […]
PCI-SIG Announces PCIe 8.0 Spec to Reach 256 GT/s
August 5, 2025 by
SANTA CLARA, CA. – August 5, 2025 – PCI-SIG today announced the PCI Express (PCIe) 8.0 specification will double the data of the PCIe 7.0 specification to 256.0 GT/s and is planned for release to members by 2028. PCI-SIG technical workgroups will be developing the PCIe 8.0 specification with the following feature objectives: Delivering 256.0 […]
Teramount Raises $50M for Optical Connectivity from AMD, Hitachi, Samsung, Koch
July 30, 2025 by
Jerusalem, July 29, 2025 — Teramount, a company focused on fiber-to-chip interconnect solutions, announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round. To meet AI’s escalating […]
Charting the Photonic Future of AI Interconnect
July 16, 2025 by
The AI revolution has been fueled by a decade-long, million-fold increase in computational capability, driven by enhanced processor efficiency. However, interconnect bandwidth has not kept pace, leaving powerful ….
AMD Acquires Enosemi for Co-Packaged Optics
May 28, 2025 by
AMD announced today the acquisition of Enosemi, a provider of chiplets, design IP and custom silicon for silicon photonics product development. AMD said the two companies have collaborated on photonics development projects, and this acquisition extends that relationship. “Now as part of AMD, the team will help us immediately scale our ability to support and develop […]
