Cerebras Systems’ dinner plate-size chip technology has been a curiosity since the company introduced the Wafer Scale Engine in 2019. But it’s become more than just a curiosity to the AI industry — and to the venture community. Today, Cerebras announced an oversubscribed $1.1 billion Series G funding round at $8.1 billion valuation. This as […]
Schneider Electric Unveils Liquid Cooling Portfolio for HPC and AI
Rueil-Malmaison, France, September 29, 2025 – Schneider Electric today unveiled its portfolio of end-to-end liquid cooling solutions for hyperscale, colocation and high-density data center environments, engineered to enable the AI factories. Available globally, the Motivair by Schneider Electric cooling solutions meet the power and GPU-intensive demands of high-density data centers reliably, and at scale. The complete […]
Fourier Cooling Launches Prefab Data Centers for HPC and AI
AUSTIN, Texas, Sept. 29, 2025 — Fourier Cooling Solutions, an AI and HPC data center infrastructure company, today announced its launch and introduced prefabricated, containerized data centers engineered to scale with the evolution of GPUs, CPUs for artificial intelligence and high-performance computing. With GPUs and high-computing servers increasing in power density, liquid cooling has become the […]
HPC News Bytes 20250929: ‘World Models’ Next Big AI Thing?, ‘Central Park-Sized’ Data Centers, Silicon Cooling Advancement, How to Tame a 6K+ Qubit Array
Good late-September morning to you! The HPC-AI world last week barreled ahead at breakneck ….
Cloudera Integrates with Dell ObjectScale for Private AI Platform
Santa Clara, California – Sept 25, 2025: Cloudera announced the integration of Dell ObjectScale with Cloudera, advancing their joint AI-in-a-Box offering and creating a Private AI platform designed for scale, governance, and economic clarity. This collaboration provides joint customers with a fully validated and integrated data platform, allowing them to run all of Cloudera’s compute engines […]
Microsoft: In-Chip ‘Microfluidics’ Improves Silicon Cooling 3X
Microsoft reported today it has successfully tested a new cooling system that removed heat up to three times better than cold plates. The system is called microfluidics, an approach that brings liquid coolant directly inside the silicon.
Nortek Data Center Cooling Unveils Skidded CDU with Multi-Megawatt Capacity
OKLAHOMA CITY, September 24, 2025 – Nortek Data Center Cooling (Nortek DCC), a Madison Air company, today announced the launch of its Skidded Coolant Distribution Unit (CDU), a liquid cooling solution engineered for high-density AI, HPC and hyperscalers. Designed to scale beyond 5 megawatts, the skidded CDU delivers precision cooling while reducing on-site labor, accelerating deployment timelines and lowering […]
StorMagic and SNUC Partner for Edge HCI Appliances
BRISTOL, England – 23 September 2025 – StorMagic today announced a new OEM agreement with SNUC under which they will offer solutions combining SNUC’s 2000- and 3000- series extremeEDGE Servers and StorMagic SvHCI. Available now to global distributors and resellers, the HCI solutions offer shared storage and real-time compute, all in a ruggedized, full-stack hyperconverged infrastructure (HCI) […]
HPC News Bytes 20250922: NVIDIA’s Intel Stake and APUs to Come, NVIDIA’s $900M Enfabrica ‘Acqui-Hire,’ Quantum Investment Goes Exponential
Happy vernal equinox to you! Developments in the world of HPC-AI last week exceeded its high standard for news value ….
Microsoft Standing up $3.3B ‘Most Powerful’ AI Data Center in Wisconsin with $4B Facility to Follow
In its not-so-modest opinion, Microsoft calls it the world’s most powerful AI data center. In a blog post from vice chair and president Brad Smith, he calls it ….













