IonQ and Hyundai Expand Quantum Partnership

Dec. 6, 2022 — COLLEGE PARK, Md.– Quantum Computing copany IonQ (NYSE: IONQ) today announced new stages of its partnership with Hyundai Motor Company to develop machine vision algorithms capable of conducting object detection on three dimensional data from autonomous vehicles. Additionally, the companies will utilize IonQ quantum computers to simulate electrochemical reactions of varying […]

TSMC’s $40B US Investment: 4nm Fab Hitting Snags, 3nm Plant Construction Has Begun

(Editor’s Note: This story, originally published on Dec. 5, was updated on Dec. 6.) Pointing to high costs and a US skills shortage, Taiwanese chip manufacturer TSMC has reported challenges to the completion by next December of its new 4 nanometer semiconductor plant north of Phoenix, according to a story in The Wall Street Journal on Dec. 5. “The $12 billion Arizona semiconductor plant under construction that President Biden is visiting Tuesday represents U.S. hopes for a renaissance in manufacturing, but the Taiwanese company building it says it won’t be easy,” the Journal article stated. “High costs, lack of trained personnel and unexpected construction snags are among the issues cited by Taiwan Semiconductor Manufacturing Co.  as it rushes to get the north Phoenix factory ready to start production in December 2023.”

Jan. 20 Deadline for Abstracts for Energy HPC Conference at Ken Kennedy Institute, Rice Univ.

Nov. 30, 2022 — Friday, Jan. 20, 2023 is the deadline to submit an extended abstract for presentation at the 16th Annual 2023 Energy High Performance Computing Conference hosted by the Ken Kennedy Institute at Rice University, February 28 – March 2, 2023. ​Acceptance notices will be issues on February 1. ​The conference invites prospective speakers […]

HPC4EI: Dec. 6 Deadline for Fall 2022 Solicitation Applications

Nov. 30, 2022 — The U.S. Department of Energy (DOE) announced up to $3 million to connect industry partners with the high-performance computing (HPC) resources and experts at DOE’s National Laboratories to tackle manufacturing challenges. Through the High-Performance Computing for Energy Innovation (HPC4EI) initiative, selected teams will apply advanced modeling, simulation, and data analysis to […]

Pre-proposals for Allocations of National Lab HPC Resources Due Nov. 28

The U.S. Department of Energy’s ASCR Leadership Computing Challenge (ALCC) is now seeking proposals for the 2023-2024 allocation year. Pre-proposals are due by 8 pm (ET) on Monday, November 28, 2022. Open to researchers from industry, academia and national laboratories, the ALCC program allocates supercomputing time at the Argonne Leadership Computing Facility, Oak Ridge Leadership Computing […]

Ansys Announces Ansys Gateway on AWS

PITTSBURGH, Oct. 31, 2022 — Today Ansys (NASDAQ: ANSS) announced the availability of Ansys Gateway powered by Amazon Web Services (AWS), which allows customers to use Ansys products in one workspace on AWS – designed to simplify access to scalable engineering solutions. Ansys Gateway powered by AWS is available in AWS Marketplace and makes it possible for […]

Staying at the Cutting Edge of Automotive Design Technology with Azure Cloud Platform and AMD

[SPONSORED CONTENT]   In automotive, first movers have a massive advantage. Success in the industry centers on vehicle R&D, at the core of which is design, performance and crash safety multi-physics software. Generating remarkably true-to-life simulations, these applications quicken vehicle time-to-market, allowing engineers to sample more design options and conduct more virtual tests in less time. […]

Rolls-Royce and Classiq Collaborate on Quantum Algorithm for Computational Fluid Dynamics

TEL-AVIV – Oct. 18 – Quantum software company Classiq today announced it is working with Rolls-Royce to implement novel computational fluid dynamics algorithm dealing with heavy, complex numerical simulations of fluid and gas phenomena. The quantum HHL algorithm, which solves a linear set of equations, can be utilized in a hybrid classical/quantum computer implementation of […]

Lockheed Martin, Ayar Labs Partner on Microchip Connectivity for Sensory Systems

BETHESDA, Md. and SANTA CLARA, Calif. – Lockheed Martin, (NYSE: LMT) and Ayar Labs, a leader in chip-to-chip optical connectivity, today announced a strategic collaboration to develop future sensory platforms that leverage Ayar Labs’ advanced optical I/O microchips that use light to transfer data faster, at a lower latency, and at a fraction of the […]

Cadence Announces AI-Driven EDA Verification Platform

SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the Cadence Verisium AI-driven verification platform, a suite of applications leveraging big data and AI designed to optimize verification workloads, boost coverage and accelerate root cause analysis of bugs. The Verisium platform is built on the new Cadence Joint Enterprise Data and AI (JedAI) […]