Beaverton, OR – April 8, 2025 – The UALink Consortium today announced the ratification of the UALink 200G 1.0 Specification, which defines a low-latency, high-bandwidth interconnect for communication between accelerators and switches in AI computing pods. The UALink 1.0 Specification enables 200G per lane scale-up connection for up to 1,024 accelerators within an AI computing pod, delivering the […]
Optical I/O: Ayar Labs Launches 8 Tbps UCIe Optical Chiplet for AI Scale-Up Architectures
Optical interconnect company Ayar Labs announced the TeraPHY optical I/O chiplet, which Ayar said is the first optical Universal Chiplet Interconnect Express (UCIe), designed to maximize AI infrastructure performance and efficiency while reducing latency and power consumption.
Photonic Fabric: Celestial AI Secures $250M Series C Funding
SANTA CLARA, CA – March 11, 2025 – Celestial AI, creator of the Photonic Fabric optical interconnect, today announced that it has raised $250 million in its Series C1 funding round led by Fidelity Management & Research Company, bringing the total capital raised to date to more than $515 million. New investors include funds and […]
@HPCpodcast: Addison Snell on the Present and Future of HPC-AI, Quantum, DeepSeek, Interconnects, Leadership Supercomputing
We delve into current market sizing for HPC-AI (the conjoining of the two being a relatively new focus), a look ahead at the rest of the year and the decade, the impact of hyperscalers on AI ….
Emerald Invests in NLM Photonics Data Center Efficiency
SEATTLE, January 29, 2025 – Emerald, a venture capital company, has invested in NLM Photonics to help bring energy-efficient, high performance electro-optic modulation technology to AI, data centers, quantum computing, and more. Other investors include Oregon Venture Fund, Tokyo Ohka Kogyo Co., Ltd., Pack Ventures, StoryHouse Ventures, and other existing NLM investors to support NLM’s […]
HPC News Bytes: The Next New Big Thing in AI?, UALink and Optical I/O, Arm vs. Qualcomm
A happy holiday season to you! As we enter Christmas week, here’s a quick (6:14) run-through of recent news from the world of HPC-AI, including: long thinking AI – the next new big thing?, UALink and optical I/O – a possible next new big thing in interconnects, Arm vs. Qualcomm ….
Photonic Interconnect: Lightmatter Joins UALink Consortium
Dec. 18, 2024, MOUNTAIN VIEW, Calif. –Photonic interconnect company Lightmatter has joined the Ultra Accelerator Link Consortium (UALink), an industry initiative focused on creating high-speed, low-latency open interconnect standards for scale-up AI systems. As a Contributor member, Lightmatter will apply its Passage technology—a 3D-stacked photonic engine—for accelerator-to-accelerator communication, enabling unprecedented performance in AI clusters. The UALink […]
Optical Interconnect: Ayar Labs Secures Investments from AMD, Intel Capital, NVIDIA in $155M Round
SAN JOSE – Dec. 11, 2024 – Ayar Labs, an optical interconnect company for large-scale AI workloads, today announced it has secured $155 million in financing led by Advent Global Opportunities and Light Street Capital. This brings the company’s total funding to $370 million and raises the company’s valuation to above $1 billion. The strength of the […]
Lenovo @ SC24: Smarter Creates Cooler HPC
[SPONSORED GUEST ARTICLE] SC24, the industry’s leading HPC technical conference, is taking place next month, and Lenovo will be there. HPC enthusiasts, influencers, and experts will gather in Atlanta, Georgia from November 17 – 22nd at the Georgia World Congress Center. This year, Lenovo’s theme is Smarter ….
Intel’s 4 TB/s Integrated Optical I/O Chiplet Called ‘Important Milestone’
Intel announced it has achieved an advance in integrated photonics technology for high-speed data transmission. The prototype OCI chiplet is designed to support 64 channels of 32 gigabits/second bidirectional data transmission on up to 100 meters of fiber optics ….