Sign up for our newsletter and get the latest HPC news and analysis.
Send me information from insideHPC:


This Week in HPC: HP Splits Up While AMD CEO Steps Down, Plus a Fall Conference Recap

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss the split of HP and the new CEO at AMD. After the break, they look back on their recent travels to a series of Fall HPC conferences.

This Week in HPC: Cray Unveils Next Generation Supercomputer and DDN Extends Product Line with Scale-out Appliance

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss the next generation Cray XC40 supercomputer with DataWarp technology as well the introduction of a new Scale-out Storage Appliance from DDN based on GPFS.

This Week in HPC: New Research from the U.S. Council on Competitiveness

The SOLVE Report is here! The Council on Competitiveness, with support from the US Department of Energy, engaged Intersect360 Research to interview 100+ companies whose use of HPC increases their competitiveness in industries such as manufacturing, finance, pharmaceuticals, and chemical engineering. These findings were published in Solve, a publication exploring how U.S. investment in HPC benefits America’s industrial and economic competitiveness.

This Week in HPC: Startup Unveils Storage-Centric Architecture and PayPal Meets Moonshot

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss the new Fortissimo Foundation from A3Cube, a clustered, pervasive, global direct-remote I/O access system. For more details, check out our A3Cube Slidecast over at insideBIGDATA. After that, they look at Paypal’s use of TI Keystone DSP processors for systems intelligence. By analyzing their chaotic real-time server data, Paypal is getting real-time, organized, intelligent results with extreme energy efficiency using HP’s Moonshot servers.

This Week in HPC: HPC Gets the Drop on Design Simulation: Collaboration with Dell, Intel, and Altair

“Impact analysis or drop testing is one of the most important stages of product design and development, and software that can simulate this testing accurately yields dramatic cost and time-to-market benefits for manufacturers. Dell, Intel and Altair have collaborated to analyze a virtual drop test solution with integrated simulation and optimization analysis, delivering proven gains in speed and accuracy. With this solution, engineers can explore more design alternatives for improved product robustness and reliability.”

This Week in HPC: Intel Rolls Haswell into Server Chips and Seagate Folds ClusterStor into Corporate Strategy

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss the broad industry impact of the new Haswell server chips for HPC. After that, they take a look Seagate’s integration of ClustStor into the company’s enterprise strategy.

This Week in HPC: Major IT Players Explore Alternate Architectures and Interest Accelerates for FPGAs and Quantum Computing

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research look at FPGAs for high performance computing. After that, they discuss the latest news on quantum computing.

This Week in HPC: Cray Creates GPU Heavy Server Node and New Exascale Recommendations for the DOE

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss the new Cray CS-Storm supercomputer based on Nvidia GPUs. After that, the discussion turns to exascale investment recommendations coming out of a new report from a Department of Energy Task Force.

This Week in HPC: DOE Labs Come Together on Climate and Latest Cuda Escalates ARMs Race

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss the ACME collaboration for climate research. In Part 2, they look at the latest Cuda release with with support for 64-bit ARM processors.

This Week in HPC: AMD Surprises with High-Performance GPU and Fujitsu Unveils Teraflop SPARC Chip

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research look at the new FirePro S9150 GPU from AMD and Fujitsu’s new Teraflop SPARC64 XIfx chip.