Ansys Cloud, the managed cloud service provided by Ansys and enabled on Microsoft Azure, recently announced availability of 3rd Gen AMD EPYC processors with AMD 3D V-Cache with HBv3 virtual machines (VMs). The development unites three powerful catalysts of innovation — chip development, simulation, and cloud computing — to offer a more robust, three-layered approach to computing without on-premises hardware restrictions.
Ansys Collaborates with Microsoft on Chips, Simulation and Cloud Computing for HPC
March 21, 2022 by
PITTSBURGH, March 21, 2022 – Ansys (NASDAQ: ANSS) today said its customers will have automatic cloud access to new 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology, available on Microsoft Azure HBv3 VMs. Ansys Cloud, the managed cloud service provided by Ansys and enabled on Azure, will automatically upgrade to the AMD chips, […]
Ansys in Silicon Photonics Partnership with GlobalFoundries
March 7, 2022 by
PITTSBURGH March 7, 2022 – Ansys (NASDAQ: ANSS) announced it is collaborating with GlobalFoundries to deliver silicon photonics solutions., using photons — instead of electrons — to transfer and move data, supporting GF’s position in the optical networking space. GF Fotonix is GF’s monolithic platform, “the first in the industry to combine its differentiated 300mm photonics […]
SiPearl Selects Ansys’ Power Signoff Solution for European Supercomputer Chip
March 1, 2022 by
March 01, 2022 — SiPearl today said the Ansys multiphysics platform has been selected by SiPearl, Europe’s exascale supercomputer chip project for development of its high performance computing (HPC) microprocessor family as part of the European Processor Initiative (EPI). SiPearl will use the Ansys RedHawk-SC simulation platform with the intent to validate semiconductor power integrity, minimize […]
Fujitsu Demonstrates Industrial Simulations on Fugaku
June 23, 2021 by
Tokyo, June 23, 2021 — Fujitsu Limited successfully leveraged on the world’s fastest supercomputer, Fugaku, to demonstrate the feasibility of high performance, large-scale, very high-definition analyses with commercial applications widely used in the industrial field for simulations including fluid dynamics. The trials were conducted in collaboration with a number of application vendors between November 2020 and […]
Big Compute 20 Conference Announces Speaker Lineup
February 6, 2020 by
Today the Big Compute Conference announced sponsors and speakers for its inaugural event, held February 11-12, 2020 in San Francisco. The two-day conference will feature business leaders and scientists describing how they are transforming their industries with access to unlimited cloud compute. “Big Compute 20 brings together thought leaders in aerospace, automotive, AI, biotech, medical, academic, technology, and chemical industries. In addition to inspiring talks, the event will feature workshops, networking, panels and a hackathon sprint, all focused on the freedom to think big.”
ANSYS Accelerates Electronic Product Design at GUC
December 20, 2019 by
Global Unichip Corp. has adopted ANSYS to support its unmatched combination of advanced technology, low-power and embedded CPU design capabilities. “GUC is committed to providing world-class custom ASICs to help elevate prospective systems and integrated circuit (IC) companies’ market-leading positions,” said Louis Lin, senior vice president, GUC. “As IC manufacturing processes become more complex, there are more elements to simulate and compute during chip design and verification to ensure reliability and minimize power loss. ANSYS helps us minimize this complexity, speed our time to market and reduce development costs. Our partnership with ANSYS has been a cornerstone in helping our clients succeed in the IC market.”
ANSYS to Acquire LSTC
September 13, 2019 by
Today ANSYS announced today that it has entered into a definitive agreement to acquire Livermore Software Technology Corporation (LSTC), the premier provider of explicit dynamics and other advanced finite element analysis technology. Once closed, the acquisition will empower ANSYS customers to solve a new class of engineering challenges, including developing safer automobiles, aircraft and trains while reducing or even eliminating the need for costly physical testing.
ANSYS Cloud HPC Increases Simulation throughput for Hundreds of Organizations
August 20, 2019 by
Engineers are unlocking increased compute capacity to achieve advancements in 5G, autonomous systems, electric vehicles, and other global megatrends thanks to ANSYS Cloud HPC, powered by Microsoft Azure. Available from directly within ANSYS engineering simulation software, ANSYS Cloud is helping organizations rapidly run high-fidelity simulations, shortening development cycles and increasing time to market. “”Organizations benefit from Azure’s vast number of on-demand compute cores to run large parallel and tightly coupled simulations, enabled by infrastructure specifically designed for HPC featuring RDMA InfiniBand. With Azure, ANSYS customers get performance without sacrificing security as sensitive proprietary data remains highly secure and protected by technologies that prohibit unauthorized access.”
Advancing manufacturing with simulation-based digital twins
June 28, 2019 by
The concept of a digital twin—the mirroring of a physical object with a virtual object created by simulation-based engineering—has been around since NASA began using numerical simulation technology and comparing the results to ground-based physical models as it developed and managed early spacecraft. “Today, digital twins are hot—a subject of intense interest and investment. Gartner puts digital twins fourth on its list of the top 10 strategic technology trends for 2019.”
