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Asetek Partners with E4 Computer Engineering, Announces Installation at CINECA

Today Asetek announced E4 Computer Engineering as a new datacenter OEM partner. E4 Computer Engineering has utilized Asetek RackCDU D2C (Direct-to-Chip) liquid cooling for the D.A.V.I.D.E. SUPERCOMPUTER in Italy. Commissioned by PRACE (The Partnership for Advanced Computing in Europe) and installed at CINECA (PRACE Italian hosting member), the innovative OpenPOWER-based D.A.V.I.D.E. supercomputer is built on top of the IBM POWER8 architecture.

Asetek Announces NEC as New Datacenter OEM Partner

Today Asetek announced NEC Corporation as a new data center OEM partner. NEC Corporation, through its subsidiary NEC Fielding, Ltd., will deploy Asetek RackCDU Direct-to-Chip liquid cooling at a new HPC installation in Japan. Asetek has already begun to make shipments in support of this installation. “Liquid cooling technology is becoming a key supercomputer component. Asetek’s direct-to-chip technology enables more effective cooling and increased computational performance in high density HPC clusters, adding value for our end-users,” said Noritaka HOSHI, (Senior Manager), NEC Corporation.

The Inflection Point of Wattage in HPC, Deep Learning and AI

Magnified in 2017 by machine learning and AI, there is a heightened concern in the HPC community over wattage trends in CPUs, GPUs and emerging neural chips required to meet accelerating computational demands in HPC clusters. In this sponsored post from Asetek, the company examines how high wattage trends in HPC, deep learning and AI might be reaching an inflection point.

Asetek lands new OEM, Channel Partner, and HPC Installation

Today Asetek announced an order from a new channel partner to service demand from a new OEM customer for an undisclosed HPC installation. All parties remain undisclosed at this time. “Adding OEMs has been a key goal for our datacenter business and it is particularly satisfying to add another significant OEM to our portfolio of customers,” said André Sloth Eriksen, CEO and founder of Asetek. “This order confirms our ability to leverage our leading position in the HPC segment to attract new customers as well as end-users.”

DOE Labs Adopt Asetek Liquid Cooling

Today Asetek announced two incremental orders from Penguin Computing, an established data center OEM. The orders are for Asetek’s RackCDU D2C™ (Direct-to-Chip) liquid cooling solution and will enable increased computing power for two currently undisclosed HPC sites at U.S. Department of Energy (DOE) National Laboratories.

Intel’s Xeon Scalable Processors Provide Cooling Challenges for HPC

Unless you reduce node and rack density, the wattages of today’s high-poweredCPUs and GPUs are simply no longer addressable with air cooling alone. Asetek explores how new processors, such as Intel’s Xeon Scalable processors, often call for more than just air cooling. “The largest Xeon Phi direct-to-chip cooled system today is Oakforest-PACS system in Japan. The system is made up of 8,208 computational nodes using Asetek Direct-to-Chip liquid cooled Intel Xeon Phi high performance processors with Knights Landing architecture. It is the highest performing system in Japan and #7 on the Top500.”

Asetek Announces Regional OEM HPC installation

Today Asetek announced an order from a new European OEM customer to service demand for an HPC (High Performance Computing) installation. “The order is for Asetek’s RackCDU D2C (Direct-to-Chip) liquid cooling solution and is valued at $32,000 USD with delivery scheduled for Q3 2017.”

Liquid Cooling for HPC Gains Momentum with Asetek at ISC 2017

“Liquid cooling is becoming the new norm in the face of skyrocketing wattages by CPUs, GPUs and cluster nodes. Asetek cooling solutions are currently provided by OEMs such as Cray, Fujitsu, Format, Penguin. Liquid cooling for NVIDIA P100, Intel Knight’s Landing and Skylake were all on display at Asetek’s booth as well as rack-level options such as InRackCDU and Vertical RackCDU.”

Penguin Computing doubles down on Asetek Liquid Cooling

Today Asetek announced an additional order from Penguin Computing for an undisclosed HPC installation. “This repeat order reflects our strong partnership with Penguin Computing. It is also another confirmation of the increasing need for liquid cooling in high density HPC clusters,” said André Sloth Eriksen, CEO and founder of Asetek.”

Increase in Wattage Trends Make Versatile Liquid Cooling the New Norm

Wattages are rising so high that to cool the nodes containing the highest performance chips used in HPC leaves one with little choice other than liquid cooling to maintain reasonable rack densities. Asetek explores how an increase in wattage trends is pushing the HPC industry toward more versatile liquid cooling options.