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Video: Asetek Advances Liquid Cooling at ISC 2018

In this video from ISC 2018, Steve Branton from Asetek describes the company’s wide array of liquid cooling solutions for HPC. “With 11 systems the TOP500 including the 9th fastest HPC installation in the world, Asetek’s RackCDU D2C is used by HPC sites worldwide to maximize sustained throughput, decrease energy use and increase cluster density. Asetek is the world-leading provider of cost-effective energy efficient liquid cooling systems for data centers, HPC clusters and high-performance PCs.”

Managed Implementation of Liquid Cooling

The need for high reliability cooling without reducing the rack density to handle high wattage nodes is no easy task. “Asetek’s direct-to-chip liquid cooling provides a distributed cooling architecture to address the full range of heat rejection scenarios. It is based on low pressure, redundant pumps and sealed liquid path cooling within each server node.”

Asetek Provides Liquid Cooling QCT at NCHC in Taiwan

Today Asetek announced the deployment of the company’s latest heat rejection technology at the National Center for High-Performance Computing (NCHC) in Hsinchu, Taiwan. “Announced in April, the new liquid cooled NCHC cluster to be implemented by QCT will focus on artificial intelligence. A major goal of the project is to achieve a significant PUE figure, requiring the use of liquid cooling to create a mix of liquid cooled NVIDIA V100 GPUs and Intel Xeon Scalable Processors in a high-density configuration. As one of Asetek’s newest OEM Partners, the NCHC installation by QCT represents both the first major HPC site resulting from the collaboration, and one of the first deployments of the latest InRackCDU.”

Asetek Liquid Cooling comes to Latest Intel Compute Modules at ISC18

Today Asetek announced plans to showcase its latest liquid cooling technology integrated in Intel Compute Modules at ISC 2018 in Frankfurt. “Asetek is excited with this next step in the ongoing collaboration with Intel,” said John Hamill, Asetek Chief Operating Officer. “The integration of Asetek liquid cooling technology in Intel Compute Modules HNS2600BPBLC and HNS7200APRL serves as further validation of low pressure distributed liquid cooling for HPC and Data Center sites.”

Asetek Receives Order For New HPC Cluster From Fujitsu

Today Asetek announced an order from Fujitsu, an established global data center OEM, for a new High Performance Computing system at a currently undisclosed location in Japan. This major installation will be implemented using Asetek’s RackCDU liquid cooling solution throughout the cluster which includes 1300 Direct-to-Chip (D2C) coolers for the cluster’s compute nodes. “We are pleased to see the continuing success of Fujitsu using Asetek’s technology in large HPC clusters around the world,” said André Sloth Eriksen, CEO and founder of Asetek.

Asetek Announces Ongoing Collaboration with Intel on Liquid Cooling for Servers and Datacenters

In anticipation of forthcoming product announcements, Asetek today announced an ongoing collaboration with Intel to provide hot water liquid cooling for servers and datacenters. This collaboration, which includes Asetek’s ServerLSL and RackCDU D2C technologies, is focused on the liquid cooling of density-optimized Intel Compute Modules supporting high-performance Intel Xeon Scalable processors.

Tohoku University Liquid Cools HPC Systems with Asetek

Today Asetek announced a new order from OEM partner Fujitsu for the Institute of Fluid Science at Tohoku University in Japan. The supercomputing system will consist of multiple computational sub-systems using the latest liquid-cooled Fujitsu PRIMERGY x86 servers, and is planned to deliver a peak theoretical performance exceeding 2.7 petaflops.

Asetek Rides the Wave of Liquid Cooling for HPC at SC17

In this video from SC17 in Denver, Steve Branton from Asetek describes the company’s wide array of liquid cooling solutions for HPC. At the Asetek booth, the company displayed liquid cooling from recently announced OEMs and channel partners in addition to cooling solutions for the latest Intel, Nvidia and IBM CPUs, accelerators and GPUs. “We are seeing higher wattage HPC nodes that require liquid cooling as they cannot be cooled with air. Wattage density is only going to get higher with the inclusion of machine learning and AI across the HPC spectrum.”

Asetek Partners with E4 Computer Engineering, Announces Installation at CINECA

Today Asetek announced E4 Computer Engineering as a new datacenter OEM partner. E4 Computer Engineering has utilized Asetek RackCDU D2C (Direct-to-Chip) liquid cooling for the D.A.V.I.D.E. SUPERCOMPUTER in Italy. Commissioned by PRACE (The Partnership for Advanced Computing in Europe) and installed at CINECA (PRACE Italian hosting member), the innovative OpenPOWER-based D.A.V.I.D.E. supercomputer is built on top of the IBM POWER8 architecture.

Asetek Announces NEC as New Datacenter OEM Partner

Today Asetek announced NEC Corporation as a new data center OEM partner. NEC Corporation, through its subsidiary NEC Fielding, Ltd., will deploy Asetek RackCDU Direct-to-Chip liquid cooling at a new HPC installation in Japan. Asetek has already begun to make shipments in support of this installation. “Liquid cooling technology is becoming a key supercomputer component. Asetek’s direct-to-chip technology enables more effective cooling and increased computational performance in high density HPC clusters, adding value for our end-users,” said Noritaka HOSHI, (Senior Manager), NEC Corporation.