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Intel steps up with 28 core Xeon Processor for High-End Workstations

Today Intel announced that their new 28-core Intel Xeon W-3175X processor is now available. “Built for handling heavily threaded applications and tasks, the Intel Xeon W-3175X processor delivers uncompromising single- and all-core world-class performance for the most advanced professional creators and their demanding workloads. With the most cores and threads, CPU PCIe lanes, and memory capacity of any Intel desktop processor, the Intel Xeon W-3175X processor has the features that matter for massive mega-tasking projects such as film editing and 3D rendering.”

Plug and Play Liquid Cooling for AI and HPC

Cutting edge AI and HPC clusters require the highest performance versions of the latest CPUs and GPUs. Coming along with the throughput, these components bring high heat loads. Often, liquid cooling becomes a requirement in these circumstances. This sponsored post from Asetek explores how increasing AI and HPC workloads, as well as accompanying components like CPUs and GPUs, are heating up computing and bringing liquid cooling to the forefront. 

How Asetek provides Flexible, Reliable, and Proven Liquid Cooling for HPC

In this video from SC18 in Dallas, Steve Branton describes how Asetek advanced liquid cooling solutions deliver Flexible, Reliable, and Proven Liquid Cooling for HPC. “Now enterprises and hyperscalers have a choice of exploiting the plug & play convenience of our high-performance liquid assisted air cooling solution – InRackLAAC – or the extreme performance, quality and reliability of our full-blown liquid cooling solution – InRackCDU.”

Asetek to Showcase Liquid Cooling Technology for AI and HPC at SC18

Today Asetek announced plans to showcase its latest liquid cooling technologies at SC18 in Dallas next week. Also on display will be Intel Compute Modules that include Asetek direct-to-chip (D2C) liquid cooling technology, validated and factory installed by Intel. “Now enterprises and hyperscalers have a choice of exploiting the plug & play convenience of our high-performance liquid assisted air cooling solution – InRackLAAC – or the extreme performance, quality and reliability of our full-blown liquid cooling solution – InRackCDU.”

Video: Asetek Advances Liquid Cooling at ISC 2018

In this video from ISC 2018, Steve Branton from Asetek describes the company’s wide array of liquid cooling solutions for HPC. “With 11 systems the TOP500 including the 9th fastest HPC installation in the world, Asetek’s RackCDU D2C is used by HPC sites worldwide to maximize sustained throughput, decrease energy use and increase cluster density. Asetek is the world-leading provider of cost-effective energy efficient liquid cooling systems for data centers, HPC clusters and high-performance PCs.”

Managed Implementation of Liquid Cooling

The need for high reliability cooling without reducing the rack density to handle high wattage nodes is no easy task. “Asetek’s direct-to-chip liquid cooling provides a distributed cooling architecture to address the full range of heat rejection scenarios. It is based on low pressure, redundant pumps and sealed liquid path cooling within each server node.”

Asetek Provides Liquid Cooling QCT at NCHC in Taiwan

Today Asetek announced the deployment of the company’s latest heat rejection technology at the National Center for High-Performance Computing (NCHC) in Hsinchu, Taiwan. “Announced in April, the new liquid cooled NCHC cluster to be implemented by QCT will focus on artificial intelligence. A major goal of the project is to achieve a significant PUE figure, requiring the use of liquid cooling to create a mix of liquid cooled NVIDIA V100 GPUs and Intel Xeon Scalable Processors in a high-density configuration. As one of Asetek’s newest OEM Partners, the NCHC installation by QCT represents both the first major HPC site resulting from the collaboration, and one of the first deployments of the latest InRackCDU.”

Asetek Liquid Cooling comes to Latest Intel Compute Modules at ISC18

Today Asetek announced plans to showcase its latest liquid cooling technology integrated in Intel Compute Modules at ISC 2018 in Frankfurt. “Asetek is excited with this next step in the ongoing collaboration with Intel,” said John Hamill, Asetek Chief Operating Officer. “The integration of Asetek liquid cooling technology in Intel Compute Modules HNS2600BPBLC and HNS7200APRL serves as further validation of low pressure distributed liquid cooling for HPC and Data Center sites.”

Asetek Receives Order For New HPC Cluster From Fujitsu

Today Asetek announced an order from Fujitsu, an established global data center OEM, for a new High Performance Computing system at a currently undisclosed location in Japan. This major installation will be implemented using Asetek’s RackCDU liquid cooling solution throughout the cluster which includes 1300 Direct-to-Chip (D2C) coolers for the cluster’s compute nodes. “We are pleased to see the continuing success of Fujitsu using Asetek’s technology in large HPC clusters around the world,” said André Sloth Eriksen, CEO and founder of Asetek.

Asetek Announces Ongoing Collaboration with Intel on Liquid Cooling for Servers and Datacenters

In anticipation of forthcoming product announcements, Asetek today announced an ongoing collaboration with Intel to provide hot water liquid cooling for servers and datacenters. This collaboration, which includes Asetek’s ServerLSL and RackCDU D2C technologies, is focused on the liquid cooling of density-optimized Intel Compute Modules supporting high-performance Intel Xeon Scalable processors.