Today Intel announced that it successfully integrated its 1.6 Tbps silicon photonics engine with its 12.8 Tbps programmable Ethernet switch. The co-packaged switch optimized for hyperscale data centers brings together the essential technology building blocks from Intel and its Barefoot Networks Division. Our co-packaged optics demonstration is the first step to making optical I/O with silicon photonics a reality,” said Hong Hou, Intel corporate vice president and general manager of the Silicon Photonics Products Division. “We share the industry belief that co-packaged optics offers power and density advantages for switches at 25 Tbps and higher, and ultimately is a necessary and enabling technology for bandwidth scalability in future networks. The timing of this demonstration shows the technology is ready to support our customers’ requirements.”