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CoolIT Systems and STULZ Debut High Density Chip-to-Atmosphere Data Center Liquid Cooling

In this video, CoolIT Systems CEO & CTO, Geoff Lyon, and STULZ ATS President, Joerg Desler, discuss high density Chip-to-Atmosphere™ data center liquid cooling solutions for organizations big or small. When integrated, CoolIT Systems’ DCLC™ solutions can capture 85% and more of the servers’ heat directly into liquid. Complimenting DCLC™, STULZ precision air cooling products capture the balance of the lower density heat. A considerable benefit forms when the total heat energy from both systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example.

CoolIT Systems Takes Liquid Cooling for HPC Data Centers to the Next Level

In this video from SC15, Patrick McGinn from CoolIT Systems describes the company’s latest advancements in industry leading liquid cooling solutions for HPC data center systems. “The adoption from vendors and end users for liquid cooling is growing rapidly with the rising demands in rack density and efficiency requirements,” said Geoff Lyon, CEO/CTO of CoolIT Systems who also chairs The Green Grid’s Liquid Cooling Work Group. “CoolIT Systems is responding to these demands with our world leading enterprise level liquid cooling solutions.”