HPC News Bytes 20250106: ‘Beyond’ EUV Lithography, China Chip Sanction Workaround, Microsoft’s $80B AI Build-Out, TSMC 2nm in 2025

Here’s a rapid (5:54) rundown of recent news from the HPC-AI sector, including: DOE and LLNL lead effort to go ‘beyond’ EUV lithography, report: ByteDance pursues chip trade sanction workaround, Microsoft’s $80B AI ….