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TSMC Offers Its FinFET Technology to Academia for IC Design Skills Development

HSINCHU, Taiwan, R.O.C., Feb. 3, 2023 – TSMC today announced the launch of its “TSMC University FinFET Program,” aimed at developing future IC design talent for the industry and empowering academic innovation. The program will provide broad educational access for students, faculty and researchers to the process design kit (PDK) of TSMC’s fin field-effect transistor […]

IBM and Samsung Unveil ‘Semiconductor Breakthrough That Defies Conventional Design’

Today, IBM and Samsung Electronics jointly announced what they said is a breakthrough in semiconductor design utilizing a new transistor architecture that allows more transistors to be packed in an IC chip. The key: the transistors stand up rather than lie down, thus taking up less space and offering “a pathway to the continuation of […]