Samsung is claiming progress on the ages-old compute-memory bottleneck inherent in the classical von Neumann computing architecture. The company has announced what it said is the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM. The company said the processing-in-memory (PIM) architecture brings AI computing capabilities inside high-performance […]
Roll Over von Neumann? Samsung Claims Progress on the Compute-Memory Divide for HPC, AI
February 18, 2021 by
Arm Throwing Elbows: LRZ to Deploy Arm-based HPE Cray CS500
June 23, 2020 by
It’s been a good week for Arm: the Fugaku supercomputer at Japan’s Riken research center was named no. 1 on the TOP500 listing of the world’s most powerful HPC systems, and today, the Leibniz Supercomputing Centre (LRZ) in Munich announced it will deploy HPE’s Cray CS500 with Fujitsu A64FX chips based on the Arm architecture – the same processor used in Fugaku (and then there’s Apple switching from x86 for new Arm chips).
Samsung Mass Producing HBM2 – World’s Fastest DRAM
January 19, 2016 by
Today Samsung Electronics announced that it has begun mass producing the industry’s first 4-gigabyte DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface, for use in high performance computing, advanced graphics and network systems, as well as enterprise servers. Samsung’s new HBM solution will offer unprecedented DRAM performance – more than seven times faster than the current DRAM performance limit, allowing faster responsiveness for high-end computing tasks including parallel computing, graphics rendering and machine learning.
