ORLANDO, FL (Jan. 5, 2026) – The IEEE Electronic Components and Technology Conference (ECTC), has extended the deadline for the Student Innovation Challenge for ECTC 2026. Six winning student teams will have the opportunity to attend ECTC 2026 with financial assistance, including travel costs up to a specified amount. Eligible participants currently enrolled in an […]
Jan. 11 Pre-registration Deadline for IEEE Electronic Components and Technology Conference Student Innovation Challenge
January 5, 2026 by
Optical I/O Company Ayar Labs Raises $130M in Series C Funding
April 26, 2022 by
SANTA CLARA, Calif. – April 26, 2022 – Ayar Labs, a chip-to-chip optical connectivity company, today announced that the company has secured $130 million in additional financing led by Boardman Bay Capital Management to drive the commercialization of its breakthrough optical I/O solution. Hewlett Packard Enterprise (HPE) and NVIDIA entered this investment round, joining existing […]
Amphenol: 112Gb/s Interconnect with eTopus Products for IP Solutions
September 14, 2021 by
San Jose, Sept. 14, 2021 – Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today announced the development of a 112Gb/s interconnect technology built on their products. This combined solution is […]
