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Call for Papers: Hot Interconnects

The 25th International Symposium on High Performance Interconnects (HotI 2017) has issued its Call for Papers. The event takes place August 29-30 at the Ericsson Campus in Santa Clara, California. “Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, data centers, and clouds. This yearly conference is attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field.”