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Intel Releases Foundational Technology Roadmap, Launches New Naming Structure for Process Nodes

Intel Corporation today announced a detailed process and packaging technology roadmaps of “foundational innovations” for products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than 10 years, and PowerVia, a backside power delivery method, the company highlighted its planned adoption of next-generation extreme ultraviolet lithography (EUV), referred […]