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HPC Network Stack on ARM

Pavel Shamis from ARM gave this talk at the MVAPICH User Group. “With the emerging availability HPC solutions based on ARM CPU architecture, it is important to understand how ARM integrates with the RDMA hardware and HPC network software stack. In this talk, we will overview ARM architecture and system software stack. We will discuss how ARM CPU interacts with network devices and accelerators. In addition, we will share our experience in enabling RDMA software stack and one-sided communication libraries (Open UCX, OpenSHMEM/SHMEM) on ARM and share preliminary evaluation results.”

Podcast: Intel Omni-Path adds Performance and Scalalability

“Intel OPA, part of Intel Scalable System Framework, is a high-performance fabric enabling the responsiveness, throughput, and scalability required by today’s and tomorrow’s most-demanding high performance computing workloads. In this interview, Misage talks about market uptake in Intel OPA’s first year of availability, reports on some of the first HPC deployments using the Intel Xeon Scalable platform and Intel OPA, and gives a sneak peek of what Intel OPA will be talking about at SC17.”

Intel’s Raj Hazra on how new technologies are Clouding our Future

In this video from ISC 2017, Raj Hazra, Corporate Vice President and General Manager of the Enterprise and Government Group at Intel, discusses key trends impacting the future growth of High Performance Computing. He focuses on the opportunities of enabling HPC in the cloud, and how this drives the need for a consistent platform that bridges the worlds of dedicated supercomputers and hyperscale cloud service providers.

Slidecast: Intel Omni-Path Architecture – A World Class High Performance Interconnect

In this slidecast, Scott Misage from Intel is our guest on the Rich Report. As the General Manager of the Intel Omni-Path Business Unit, Scott has a lot to say about scalability, performance, and market momentum for this powerful interconnect technology. He also provides a preview of ISC 2017, where Intel Omni-Path will be in the spotlight as a rising star on the TOP500.

Why Intel Omni-Path is Growing Fast on the TOP500

In this video from SC16, Joe Yaworsky describes how Intel Omni Path is gaining traction on the TOP500. As the interconnect for the Intel Scalable System Framework, Omni-Path is focused on delivering the best possible application performance. “In the nine months since Intel Omni-Path Architecture (Intel OPA) began shipping, it has become the standard fabric for 100 gigabit systems. Intel OPA is featured in 28 of the top 500 most powerful supercomputers in the world announced at Supercomputing 2016 and now has 66 percent of the 100Gb market. Top500 designs include Oakforest-PACS, MIT Lincoln Lab and CINECA.”

Intel Omni-Path Architecture Fabric, the Choice of Leading HPC Institutions

Intel Omni-Path Architecture (Intel OPA) volume shipments started a mere nine months ago in February of this year, but Intel’s high-speed, low-latency fabric for HPC has covered significant ground around the globe, including integration in HPC deployments making the Top500 list for June 2016. Intel’s fabric makes up 48 percent of installations running 100 Gbps fabrics on the Top500 June list, and they expect a significant increase in Top500 deployments, including one that could end up in the stratosphere among the top ten machines on the list.

High Performance Interconnects: Assessment & Rankings

In this video from the HPC Advisory Council Spain Conference, Dan Olds from OrionX discusses the High Performance Interconnect (HPI) market landscape, plus provides ratings and rankings of HPI choices today. “In this talk, we’ll take a look at the technologies and performance of high-end networking technology and the coming battle between onloading vs. offloading interconnect architectures.”

Supermicro Now Shipping Intel Xeon Phi Systems with Omni-Path

“With our latest innovations incorporating Intel Xeon Phi processors in a performance and density optimized Twin architecture and 100Gbps OPA switch for high bandwidth connectivity, our customers can accelerate their applications and innovations to address the most complex real world problems.”

Video: Matching the Speed of SGI UV with Multi-rail LNet for Lustre

Olaf Weber from SGI presented this talk at LUG 2016. “In collaboration with Intel, SGI set about creating support for multiple network connections to the Lustre filesystem, with multi-rail support. With Intel Omni-Path and EDR Infiniband driving to 200Gb/s or 25GB/s per connection, this capability will make it possible to start moving data between a single SGI UV node and the Lustre file system at over 100GB/s.”

Kyoto University Thinks Widening SIMD Will be Key to Performance Gains in New Intel Xeon Phi processor-based Cray System

“With an imminent switchover to a new Cray system with next-generation Intel Xeon Phi Processors (codenamed Knights Landing) planned for October, the ACCMS team at Kyoto University is eagerly looking forward to a potential two-fold application performance improvements from its new system. But the lab is also well aware that there is significant recoding work ahead before the promise of the new manycore technology can be realized.”