The AI revolution has been fueled by a decade-long, million-fold increase in computational capability, driven by enhanced processor efficiency. However, interconnect bandwidth has not kept pace, leaving powerful ….
Lightmatter Announces Passage L200, Co-Packaged Optics for AI
April 2, 2025 by
MOUNTAIN VIEW, Calif.– Photonic supercomputing company Lightmatter announced Passage L200, which the company said is the first 3D co-packaged optics (CPO) product. Designed to integrate with the latest XPU and switch silicon designs, Passage L200 supports unprecedented AI performance scaling by eliminating interconnect bandwidth bottlenecks, the company said. The L200 3D CPO family includes both […]
Photonic Interconnect: Lightmatter Joins UALink Consortium
December 18, 2024 by
Dec. 18, 2024, MOUNTAIN VIEW, Calif. –Photonic interconnect company Lightmatter has joined the Ultra Accelerator Link Consortium (UALink), an industry initiative focused on creating high-speed, low-latency open interconnect standards for scale-up AI systems. As a Contributor member, Lightmatter will apply its Passage technology—a 3D-stacked photonic engine—for accelerator-to-accelerator communication, enabling unprecedented performance in AI clusters. The UALink […]
Lightmatter and Amkor Technology Partner on 3D Photonics Package
November 14, 2024 by
MOUNTAIN VIEW, Calif., Nov. 14, 2024 — Photonic supercomputing company Lightmatter today announced a strategic partnership with Amkor Technology, Inc. (Nasdaq: AMKR), a provider of semiconductor packaging and test services, to create the largest-ever 3D-packaged chip complex utilizing Lightmatter’s innovative Passage platform. This collaboration harnesses Lightmatter’s groundbreaking 3D-stacked photonic engine along with Amkor’s advanced multi-die packaging expertise to […]
Photonics Compute and Interconnect Startup Lightmatter Raises $154M Series C Funding, Targets HPC and AI Workloads
June 1, 2023 by
BOSTON – Photonics computing company Lightmatter announced it has raised $154 million in a Series C investment round, bringing to $270 million that the company has raised. Participants in this latest round are SIP Global, Fidelity Management & Research Company, Viking Global Investors, GV (Google Ventures), HPE Pathfinder and existing investors. The company said it will […]
Photonics Company Lightmatter Names Google TPU Engineer Richard Ho VP of Hardware Engineering
August 23, 2022 by
BOSTON — Photonics company Lightmatter has named Richard Ho its new Vice President of Hardware Engineering. Ho spent nearly nine years at Google leading the Cloud Tensor Processing Units (TPU) project. At Lightmatter, Ho will spearhead Lightmatter’s chip engineering division with focus on developing and deploying Lightmatter’s photonic AI accelerator and wafer-scale interconnect, designed for […]
