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Parker Hannifin to Showcase Liquid Cooling Solutions at SC19

Parker Hannifin will showcase their latest quick connect couplings for liquid cooling at SC19 in Denver. “Recognized as the largest manufacturer of quick couplings in the world, Parker couplings incorporate non-spill valving, meaning no spills during connection and disconnection. At the core is a flat-sealing design that prevents any type of fluid loss against sensitive electronics and all electrical connections. This ensures the highest level of compatibility with the broadest range of liquids and the application environment.”

Nortek Unveils World’s Most Powerful CDU for Data Center Liquid Cooling

Today Nortek Air Solutions rolled out its new CDU1200, a 1,200-kW coolant distribution unit (CDU). As the single most powerful, compact CDU on the planet, the CDU1200 is the newest addition to its ServerCool data center liquid cooling product line. “The CDU1200 is a perfect new construction or retrofit liquid cooling solution for high performance computing and enterprise data centers, as well co-location, corporate network edge, government, research and other data center formats. In an age where liquid cooling is required to support growing chip power densities, the CDU1200’s kW/ft2 capacity is unrivalled when directly compared to competitor products.”

Liquid Cooling: Unlock Greater Potential in HPC

Werner Scholz from XENON Systems gave this talk at the Perth HPC Conference. “Today, Intel’s highest performing CPUs (e.g. Intel Cascade Lake-AP 9282 processor) have a thermal design envelope of 400 watts. There really is no end in sight, and accommodating more power is critical to advancing performance. The ability to dissipate the resulting heat is the hard ceiling that systems face in terms of performance – giving greater importance to liquid cooling breakthroughs. With liquid cooling, less energy is expended to cool systems – a significant savings in HPC deployments with arrays of servers drawing energy and generating heat.”

Schneider Electric teams with Iceotope for Liquid-Cooled Datacenters

Today Schneider Electric announced it is teaming up with Avnet and Iceotope to jointly develop innovative, chassis-level immersive liquid cooling solutions for data centers. This newly announced partnership brings together three global technology innovation leaders: Avnet for technology integration services; Iceotope for chassis-level immersion cooling technologies; and Schneider Electric for data center infrastructure solutions. “The development of a liquid cooling technology solution offers customers the performance needed to deliver on these growing compute demands.”

Immersive Cooling from Submer Technologies coming to EU Joint Research Center in Italy

In a collaborative effort with Airbus, Submer Technologies and 2CRSi are providing supercomputer-speed processing in high-density clusters to support real-time workloads for advanced Artificial Intelligence (AR) cybersecurity research applications at the JRC campus. “This is one of our most important installations yet. It’s a mission-critical, high-density compute environment where physical space and energy compliance are important considerations,” said Daniel Pope, CEO of Submer. “We designed the SmartPod to address all of these issues – making this project a perfect use-case for our liquid immersion cooling platform.”

New Liquid Cooled AMD EPYC 7H12 Processor Breaks Performance Records

Today AMD announced a new addition to the 2nd Generation AMD EPYC family, the AMD EPYC 7H12 processor. The 64 core/128 thread, 2.6Ghz base frequency, 3.3Ghz max boost frequency, 280W TDP processor is specifically built for HPC customers and workloads, using liquid cooling to deliver leadership supercomputing performance. “In an ATOS testing on their BullSequana XH2000, the new AMD EPYC 7H12 processor has set four new world-records in server performance. With a LINPACK score of ~ 4.2 TeraFLOPS, the new chip performs ~11% better than the AMD EPYC 7742 processor.”

Thermoplastic Connectors Grow in Popularity Along with Liquid Cooling

As liquid cooling becomes more and more prevalent, new technology and types of connectors are becoming water cooler topics for those in the data and computing industries. According to a new report from CPC, long-term, leak-free performance in fluid management systems requires robust connectors. And advanced materials are growing the range of available QD options.

Metal or Plastic Quick Disconnects? Key Considerations

Long-term, leak-free performance in fluid management systems requires robust connectors. As liquid cooling is increasingly deployed in high performance computing and data center applications, these industries demand quick disconnects (QDs) purpose-built for their needs. Gone are the days of making do with metal ball-and-sleeve connectors designed for heavy industrial use. Download the new guide from CPC that outlines key performance factors of new PPSU QDs compared to traditional all-metal QDs for liquid cooling.

Cooling Challenges for Ultra-high Density Compute Clusters

Miguel Terol from Lenovo gave this talk at HPCKP’19. “Technology players are refining their chip and platform designs to enable much denser systems. The trade-off of this trend is chips are getting more and more power hungry, and cooling those components becomes a challenge in terms of sustainability, either for the environment or the economy. In this talk we will present the high density technology landscape and different approaches to address the cooling challenges.”

GRC Launches Immersion Cooled Micro-Modular Data Center Solution

Today GRC announced the launch of a new micro-modular data center solution, the ICEraQ Micro, a rapidly deployable self-contained 24U server rack that can support up to 50kW of critical IT load and is nearly half the cost of other micro-modular solutions. “ICEraQ Micro gives IT professionals the freedom to easily add high-density computing, virtually anywhere.”