SAN JOSE — February 25, 2021 – NeoPhotonics Corporation (NYSE: NPTN), a leading developer of silicon photonics and advanced hybrid photonic integrated circuit-based lasers, modules and subsystems for bandwidth-intensive, high speed communications networks, today announced availability of its extended case temperature QSFP-DD 400G ZR modules. These 400G ZR modules utilize NeoPhotonics’ industry leading coherent optical components […]
NeoPhotonics 400G ZR Modules Support Extended Operation up to 80C Case Temperatures
February 25, 2021 by Leave a Comment
Flexibly Scalable High Performance Architectures with Embedded Photonics
July 7, 2019 by
Keren Bergman from Columbia University gave this talk at PASC19. “Data movement, dominated by energy costs and limited ‘chip-escape’ bandwidth densities, is a key physical layer roadblock to these systems’ scalability. Integrated silicon photonics with deeply embedded optical connectivity is on the cusp of enabling revolutionary data movement and extreme performance capabilities.”
Video: Hewlett Packard Labs teams with Mentor for LightSuite Photonic Compiler
September 14, 2018 by
“Mentor’s LightSuite Photonic Compiler represents a quantum leap in automating what has up to now been a highly manual, full-custom process that required deep knowledge of photonics as well as electronics,” said Joe Sawicki, vice president and general manager of the Design-to-Silicon Division at Mentor, a Siemens business. “With the new LightSuite Photonic Compiler, Mentor is enabling more companies to push the envelope in creating integrated photonic designs.”
Dr. Keren Bergman and Thomas Sterling to Keynote ISC 2018
March 27, 2018 by
Today ISC 2018 announced that Dr. Keren Bergman from Columbia University will give a keynote on the latest developments in silicon photonics. The event takes place June 24-28 in Frankfurt.
Intel’s Al Gara Presents: Technology Opportunities Like Never Before
January 11, 2018 by
Al Gara from gave this talk at the Intel HPC Developer Conference in Denver. “Technology visionaries architecting the future of HPC and AI will share the key challenges as well as Intel’s direction. The talk will cover the adaptation of AI into HPC workflows, along their perspective architectural developments, upcoming transitions and range of solutions, technology opportunities, and the driving forces behind them.”
New Paper Describes Next-gen Ultralow-Power Optical Interconnects
December 21, 2013 by
MIT Technology Review has posted details on a new generation of ultralow power optical interconnects.
