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TSMC Debuts FINFLEX, N2 Process

SANTA CLARA, CA, Jun. 16, 2022 – TSMC today showcased its advanced logic, specialty and 3D IC technologies at the company’s 2022 North America Technology Symposium, with the next-generation N2 process utilizing nanosheet transistors and the FINFLEX technology for the N3 and N3E processes making their debuts. Highlighted at the symposium: TSMC’s N3 technology, set […]