SANTA CLARA, CA, Jun. 16, 2022 – TSMC today showcased its advanced logic, specialty and 3D IC technologies at the company’s 2022 North America Technology Symposium, with the next-generation N2 process utilizing nanosheet transistors and the FINFLEX technology for the N3 and N3E processes making their debuts. Highlighted at the symposium: TSMC’s N3 technology, set […]
[SPONSORED GUEST ARTICLE] …. developments in photonics-based interconnects are so intriguing, offering the promise of increasing bandwidth by up to 1000x at 10%….
The high-performance computing (HPC) market is witnessing a notable shift towards the cloud, partially driven by the benefits of enhanced energy efficiency. According to Hyperion Research nearly every organization running HPC workloads is either already using or investigating the cloud to accelerate application performance, with the cloud market for HPC workloads forecast to reach $11.5 […]
Featured RSS Feed More News from insideBIGDATA
