TSMC Debuts FINFLEX, N2 Process

SANTA CLARA, CA, Jun. 16, 2022 – TSMC today showcased its advanced logic, specialty and 3D IC technologies at the company’s 2022 North America Technology Symposium, with the next-generation N2 process utilizing nanosheet transistors and the FINFLEX technology for the N3 and N3E processes making their debuts. Highlighted at the symposium: TSMC’s N3 technology, set […]

Synopsys Work Flows Certified for Next-Generation Mobile and HPC Designs on TSMC N3E and N4P Processes

MOUNTAIN VIEW, Calif., June 13, 2022 — Aiming to help customers optimize performance, power and area (PPA) for next-generation system-on-chips (SoCs) used in mobile and high-performance computing applications, Synopsys, Inc. (Nasdaq: SNPS) today announced that TSMC has certified the Synopsys digital and custom design flows for its N3E and N4P process technologies. In addition, Synopsys’ leading Foundation IP […]