IBM Quantum Debuts 133-Qubit Processor and New System

Today, at its annual IBM Quantum Summit in New York, the company debuted the 133-qubit Quantum Heron, the first in what IBM said will be a series of utility-scale quantum processors whose architecture has been engineered over the past four years. IBM said the processor “deliver(s) IBM’s highest performance metrics and lowest error rates….”

HPC News Bytes 20231204: The New Yorker on NVIDIA, the Open Benchmark Council, Intel and TSMC, Digital Twins for Hydropower

Here’s a sprint (5:16) through the latest HPC -AI news, including: NVIDIA’s big feature story in The New Yorker, the Open Benchmark Council’s TOP100 lists, Intel and TSMC’s high-end 3 nanometer fab, digital twins for hydropower at ORNL and PNNL.

HPE Announces GenAI Collaboration with NVIDIA, AI-native Architecture and Hybrid Cloud Solutions

Hewlett Packard Enterprise announced at HPE Discover Barcelona 2023 the next series of AI-native and hybrid cloud offerings for machine learning development, data analytics, AI-optimized file storage, AI tuning and inferencing and professional services.  HPE announced these AI-….

@HPCpodcast: Tech Analyst Adrian Cockcroft on Trends Driving Future HPC Architectures

Along with his article to be found on this site, technology analyst Adrian Cockcroft of OrionX (and former AWS vice president) joins Shahin and Doug after SC23 to discuss TOP500 trends, the AI-HPC crossover, liquid cooling, chiplets, and the emergence of UCIe and CXL – some of the anticipated advancements are truly eye-popping. In this podcast, sponsored by Lenovo, the relentless pursuit of higher performance, the acceleration in the pace of change in high performance processing, is examined.

SC23: TOP500 Trends, the AI-HPC Crossover, Chiplet Standardization, the Emergence of UCIe and CXL Advancements

By Adrian Cockcroft, Partner & Analyst, OrionX Last year the UCIe chiplet standard had just been launched, and since then just about everyone has joined it, about 130 companies. The idea is that to build a complete CPU or GPU you don’t have to put it all on the same chip from the same….

AWS Unveils Graviton4, Trainium2 Chips

Today at AWS re:Invent, Amazon Web Services announced the next generation of two AWS-designed chip families — AWS Graviton4 and AWS Trainium2 — that the company said delivers  advancements in price performance and energy efficiency for such workloads as machine learning (ML) training and generative artificial intelligence (AI) applications.

Hyperion Research Announces Winners of HPC Innovation Excellence Awards

HPC industry analyst firm Hyperion Research has announced the recipients of the 19th round of HPC Innovation Excellence Awards. The 2023 winners are: FedData Technology Solutions, Boston University, McMaster University and HPE, and HLRS and WIKKI GmbH.

PASQAL and Investissement Québec Launch $90M Quantum Initiative

Nov. 27, 2023 — French quantum computing company PASQAL announced it is part of the inauguration of Espace Quantique 1, a $90 million quantum initiative, in the center of the DistriQ Quantum Innovation Zone in Sherbrooke, Quebec, showcasing its approach to developing neutral atom quantum computers. The project aims to conduct manufacturing and commercialization activities […]

ALCF: Groq AI Online Workshop, Dec. 6-7

The Argonne Leadership Computing Facility will host an online workshop to learn about the ALCF’s new GroqRack system on Monday and Tuesday, Dec. 6 and 7 from 1:30 to 5 pm Central Time. To register go here. The ALCF said the Groq machine’s AI inference capabilities can assist users in making predictions, discovering patterns in […]

TierPoint Selects DDC Cabinet Technology for AI Workloads in High-Density Data Center

San Diego – DDC Cabinet Technology, maker of scalable data center-to-edge solutions that feature patented Dynamic Density Control (DDC) technology, announced the company’s ‘better than liquid’ cooling technology will support the augmentation of a TierPoint data center in eastern Pennsylvania, helping meet explosive demand for AI workloads and representing one of the largest ultra-high-density, single-user […]