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The GigaIO™ FabreX™ Network – New Frontiers in Networking For Big Data

In order to derive meaning from big data, via implementing the capabilities of big data analytics, and create new opportunities and new value, organizations must find a way to obtain radically increased overall system throughput. This whitepaper describes how the GigaIO FabreX network makes such accelerated functionalities possible by achieving exceptionally low latency and high-bandwidth performance across an organization’s entire network.

Cloud Adoption for HPC: Trends and Opportunities

This whitepaper is an insideHPC Special Research Report sponsored by Univa® Corporation: Cloud Adoption for HPC:
Trends and Opportunities. Recently, InsideHPC ran a survey, sponsored by Univa, to identify the trends and opportunities for adoption of HPC workflows in the cloud. There were 143 respondents: 39% academic/non-profit, 17%  manufacturing or engineering, 11% government research; 59% North America, 24% Europe, 8% Asia; 59% with less than 20,000 employees. This whitepaper is a summary of what was learned from this survey.

The Use of High-Performance Polymers in HPC and Data Center Applications

This whitepaper from CPC details the use of high-performance polymers in HPC and data center applications where plastics advance as a viable, reliable option in liquid cooling systems. CPC offers the industry’s first PPSU QD, purpose-built for liquid cooling use in HPC and data centers.

Data Center Transformation: Why a Workload-Driven and Scalable Architecture Matters

In this whitepaper QCT (Quanta Cloud Technology) highlights Data Center Transformation: Why a Workload-Driven and Scalable Architecture Matters. The company is offering its QCT Platform on Demand (QCT POD) solution that empowers enterprises to kickstart their transformation journey. It combines advanced technology with a unique user experience to help enterprises reach better performance and gain more insights. With flexibility and scalability, QCT POD enables enterprises to address a broader range of HPC, Deep Learning, and Data Analytic demands that fulfill various applications.

Critical Liquid Cooling Considerations in Electronics

As data centers and high performance computing continue to drive demand for higher densities and increased efficiency, liquid cooling is expanding as a method of thermal management. Download the new white paper from CPC that provides a technical guide for connectors when considering a liquid cooling system for your HPC and data center environments.

LiquidCool Solutions Technical Evaluation

LiquidCool Solutions has developed a liquid submerged server (LSS) technology that changes the way computer electronics are cooled. The technology provides an option to cool electronics by the direct contact flow of dielectric fluid (coolant) into a sealed enclosure housing all the electronics of a single server. The intimate dielectric fluid contact with electronics improves the effectiveness of heat removal from the electronics.

Impact of Meltdown and Spectre Vulnerabilities on HPC

“Performance is important in high performance computing. A performance impact on HPC use can be more than a simple annoyance. Because of the high investment cost and energy usage of HPC systems, a performance impact can have a signi cant effect on price per compute job. As we have discussed in the previous sections, the “page table isolation” workarounds have an overhead on entering and leaving the kernel. Luck happens that in HPC, computers spend most of their time in user space, doing computations. Low-latency networks such as In niband allow HPC systems to perform network communication without involving the kernel. Therefore during HPC computations, the Linux kernel might not be actively involved and the CPUs are running at full power.”

Enabling Next-Generation Platforms Using Intel’s 3D System-in-Package Technology

This white paper evaluates system requirements for next-generation platforms and explains why conventional solutions may no longer be able to meet these requirements effectively. The paper introduces the heterogeneous 3D system- in-package (SiP) technology featured in Intel Stratix 10 FPGAs and SoCs. This technology enables next-generation platforms by powering higher bandwidth, lower power, a smaller form factor, and increased functionality and fledibility. Stratix 10 FPGAs and SoCs feature 3D SiP-based transceivers across all densities.

Energy Efficiency in the Software Stack — Cross Community Efforts

This report covers events at SC17 that focused on energy efficiency and highlights ongoing collaborations across the community to develop advanced software technologies for system energy and power management.

Accelerating the speed and accessibility of artificial intelligence technologies

As AI technologies become even faster and more accessible, the computing community will be positioned to help organizations achieve the desired levels of efficiency that are critically needed in order to resolve the world’s most complex problems, and increase safety, productivity, and prosperity. Learn more about AI Technologies … download this white paper.