SEOUL, Nov. 12, 2024 — LG Electronics (LG) and Tenstorrent announces an expanded collaboration that builds on their initial chiplet project to develop System-on-Chips (SoCs) and systems for the global market. Through this partnership, LG aims to enhance its design and development capabilities for AI chips tailored to its products and services, aligning with its […]
BullSequana eXascale Interconnect V3: Intelligent Network Management Accelerates GPU Performance in AI-HPC
November 6, 2024 by
[SPONSORED GUEST ARTICLE] While the compute power of GPUs has grown significantly…, networking infrastructure has not kept up at the same rate.
Tenstorrent Deploys Arteris Network-on-Chip IP
November 5, 2024 by
CAMPBELL, Calif. – Nov. 5, 2024 – Arteris, Inc. (Nasdaq: AIP), a provider of system IP designed to accelerates system-on-chip (SoC) creation, today announced Tenstorrent has licensed its network-on-chip (NoC) IP for on-chip connectivity in its chiplet-based products. The configurable NoC interconnect is intended to meet the workload and time-to-market requirements to deliver computing for […]
HPC News Bytes 20241104: India Rising with AI, HBM an HPC-AI Bottleneck, Novel Accelerator Architectures, CHIPS Act for Extreme Ultraviolet Lithography
November 4, 2024 by
A happy first Monday of November to you! The world of HPC-AI was notably active last week, here’s a rapid (7:36) run through: India seen as a rising tech power….
Move Over Von Neumann? Sandia to Deploy NextSilicon’s ‘Intelligent Compute Accelerator’
October 30, 2024 by
NextSilicon, the Israel-based startup whose intriguing software-defined hardware has been talked about in concept for years by the company, today unveiled what it said is the first Intelligent Compute Accelerator (ICA).
Infineon Unveils Thin Silicon Wafer for AI Data Centers
October 29, 2024 by
Infineon Technologies AG announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever manufactured,” with a thickness of 20 micrometers and a diameter of 300 millimeters, in a high-scale semiconductor fab.
HPC News Bytes 20241021: Exascale Day Shift, Quantum in China, the Great Grace Hopper, Awards and Conferences
October 21, 2024 by
A happy peak foliage (for some) day to you! Here’s a quick (5:44) jaunt through recent news in the world of HPC-AI, including: a shift in Exascale Day focus, did a Chinese quantum computer crack military grade encryption?, the great Grace Hopper ….
Lenovo Launches ‘100%’ Liquid Cooled Platforms with Nvidia for GenAI
October 15, 2024 by
Lenovo called the 6th generation ThinkSystem N1380 Neptune a “vertical liquid cooling breakthrough” that supports accelerated computing while reducing power consumption by up to 40 percent… Lenovo, of course, has long been active in liquid cooling ….
Dell AI Factory Offers New Cooling, High Density Compute and AI Storage
October 15, 2024 by
Round Rock, TEXAS – October 15, 2024: Dell Technologies (NYSE: DELL) introduced integrated rack-scalable systems, server, storage and data management innovations to the Dell AI Factory, for high density computing and AI workloads at scale. The Dell Integrated Rack 7000 (IR7000) is designed to handle accelerated computing demands with high density, more sustainable power management and […]
AMD Launches CPU, GPU and DPU Chips Aimed at Big AI
October 10, 2024 by
Today in San Francisco AMD announced updated versions of its chips portfolio and moved to position itself as an across-the-board provider of data center technology for organizations implementing Big AI. The company also said it is speeding up its product release cadence, a move clearly aimed at ….
