WASHINGTON, DC, Dec. 17, 2024 — The U.S. Department of Energy (DOE) today announced that 10 of its national labs will establish the Semiconductor Manufacturing and Advanced Research with Twins USA (SMART USA) Institute, a manufacturing institute intended to support domestic semiconductor production through advanced digital twin technology. SMART USA will leverage the digital twin, or […]
Synopsys and SiMa.ai in Collaboration to Develop Automotive Edge AI Solutions
December 17, 2024 by
Dec 17, 2024, SUNNYVALE, Calif. and SAN JOSE, Dec. 17, 2024 — Synopsys (Nasdaq: SNPS) and SiMa.ai today announced a collaboration to deliver a solution for automotive companies to accelerate development of workload-specific silicon and software needed to power AI-enabled features. The solution will combine Synopsys’ EDA, automotive-grade IP, and hardware-assisted verification solutions with SiMa.ai’s machine learning accelerator (MLA) IP and ML software […]
Dell Shipping Blackwell-Powered Server Racks as Part of Relationship with CoreWeave for AI at Scale
December 9, 2024 by
Dell Technologies (NYSE: DELL) announced the expansion of its relationship with AI hyperscaler CoreWeave and reported that it is shipping Dell PowerEdge XE9712 server racks with NVIDIA GB200 NVL72, which Dell said is an industry first, to support CoreWeave’s Cloud Services Platform. CoreWeave will receive1 liquid-cooled Dell IR7000 racks with Dell PowerEdge XE9712 servers, supported by Dell’s AI professional […]
Tenstorrent Closes $693M+ Series D Round
December 2, 2024 by
Dec. 2, 2024, Santa Clara, CA: Tenstorrent said it closed over $693M in its Series D funding round at a pre-money valuation of $2B. Samsung Securities and AFW Partners led the oversubscribed round. In addition to the leads, other investors joined the round including XTX Markets, Corner Capital, MESH, Export Development Canada, Healthcare of Ontario Pension […]
Tenstorrent and LG Electronics Expand Chip Partnership
November 13, 2024 by
SEOUL, Nov. 12, 2024 — LG Electronics (LG) and Tenstorrent announces an expanded collaboration that builds on their initial chiplet project to develop System-on-Chips (SoCs) and systems for the global market. Through this partnership, LG aims to enhance its design and development capabilities for AI chips tailored to its products and services, aligning with its […]
BullSequana eXascale Interconnect V3: Intelligent Network Management Accelerates GPU Performance in AI-HPC
November 6, 2024 by
[SPONSORED GUEST ARTICLE] While the compute power of GPUs has grown significantly…, networking infrastructure has not kept up at the same rate.
Tenstorrent Deploys Arteris Network-on-Chip IP
November 5, 2024 by
CAMPBELL, Calif. – Nov. 5, 2024 – Arteris, Inc. (Nasdaq: AIP), a provider of system IP designed to accelerates system-on-chip (SoC) creation, today announced Tenstorrent has licensed its network-on-chip (NoC) IP for on-chip connectivity in its chiplet-based products. The configurable NoC interconnect is intended to meet the workload and time-to-market requirements to deliver computing for […]
HPC News Bytes 20241104: India Rising with AI, HBM an HPC-AI Bottleneck, Novel Accelerator Architectures, CHIPS Act for Extreme Ultraviolet Lithography
November 4, 2024 by
A happy first Monday of November to you! The world of HPC-AI was notably active last week, here’s a rapid (7:36) run through: India seen as a rising tech power….
Move Over Von Neumann? Sandia to Deploy NextSilicon’s ‘Intelligent Compute Accelerator’
October 30, 2024 by
NextSilicon, the Israel-based startup whose intriguing software-defined hardware has been talked about in concept for years by the company, today unveiled what it said is the first Intelligent Compute Accelerator (ICA).
Infineon Unveils Thin Silicon Wafer for AI Data Centers
October 29, 2024 by
Infineon Technologies AG announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever manufactured,” with a thickness of 20 micrometers and a diameter of 300 millimeters, in a high-scale semiconductor fab.
