Video: AI for Science
Rick Stevens from Argonne gave this talk at the HPC User Forum. “Argonne has launched an “AI for Science” initiative aimed at accelerating the development and adoption of AI approaches in scientific and engineering domains with the goal to accelerate research and development breakthroughs in energy, basic science, medicine, and national security, especially where we have significant volumes of data and relatively less developed theory. AI methods allow us to discover patterns in data that can lead to experimental hypotheses and thus link data driven methods to new experiments and new understanding.” [READ MORE…]
Featured Stories
Massively Parallel Computer Aided Design of Nano-Transistors: When Physics Lets You Down
“In this talk, the capabilities of a state-of-the-art quantum mechanical device simulator will be briefly reviewed, insisting on the developed multi-level parallelization scheme and highlighting the fact that physics can lead to wrong assumptions regarding the best-suited distribution of the workload. This problem will be addressed through a data-centric transformation of the code.” [READ MORE…]
Intel Ships Stratix 10 DX FPGAs
Intel today announced shipments of new Intel Stratix 10 DX field programmable gate arrays (FPGA). “Stratix 10 DX FPGAs with the new interfaces include the option to support select Intel Optane DC persistent memory dual in-line memory modules (DIMMs). They dramatically increase bandwidth and provide coherent memory expansion and hardware acceleration for upcoming select Intel Xeon Scalable processors.” [READ MORE…]
A Simulation Booster for Nanoelectronics
Researchers from ETH Zurich have developed a method that can simulate nanoelectronics devices and their properties realistically, quickly and efficiently. This offers a ray of hope for the industry and data centre operators alike, both of which are struggling with the (over)heating that comes with increasingly small and powerful transistors – and with the high resulting electricity costs for cooling. [READ MORE…]
Featured Resource
Metal or Plastic Quick Disconnects? Key Considerations
Long-term, leak-free performance in fluid management systems requires robust connectors. As liquid cooling is increasingly deployed in high performance computing and data center applications, these industries demand quick disconnects (QDs) purpose-built for their needs. Gone are the days of making do with metal ball-and-sleeve connectors designed for heavy industrial use. Download the new guide from CPC that outlines key performance factors of new PPSU QDs compared to traditional all-metal QDs for liquid cooling.
Industry Perspectives
Podcast: Extreme Power and Cooling Efficiency at DownUnder GeoSolutions
In this podcast, the Radio Free HPC team looks at an interesting presentation on Power and Cooling by Stuart Midgley from DownUnder Geosolutions. Their 250 Petaflop “Bubba” supercomputer uses immersive cooling for extreme density and power efficiency. [READ MORE…]
Leadership Performance with 2nd-Generation Intel Xeon Scalable Processors
According to Intel, its new 2nd generation Intel Xeon Scalable Processor family includes Intel Deep Learning Boost for AI deep learning inference acceleration, fresh features and support for Intel Octane DC (data center) persistent memory, and more. Learn more about the offerings in a new issue of Parallel Universe Magazine. [READ MORE…]
Featured from insideBIGDATA
- Despite $6.1 Billion in Funding, China Not Leading in AI InnovationOver the past four years, Chinese artificial intelligence (AI) startups have received $6.1 billion in funding. However, despite immense amounts of investment and being second only to the U.S. in number of companies focusing on AI, China is not leading in cutting-edge AI innovation. To better understand the progress of AI in China, our friends […]
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Editor’s Choice
New Liquid Cooled AMD EPYC 7H12 Processor Breaks Performance Records
Today AMD announced a new addition to the 2nd Generation AMD EPYC family, the AMD EPYC 7H12 processor. The 64 core/128 thread, 2.6Ghz base frequency, 3.3Ghz max boost frequency, 280W TDP processor is specifically built for HPC customers and workloads, using liquid cooling to deliver leadership supercomputing performance. “In an ATOS testing on their BullSequana XH2000, the new AMD EPYC 7H12 processor has set four new world-records in server performance. With a LINPACK score of ~ 4.2 TeraFLOPS, the new chip performs ~11% better than the AMD EPYC 7742 processor.” [READ MORE…]
ExaNeSt Project Successfully Builds Prototype for Exascale
In this video, researchers describe the results from the ExaNeSt project. “The prototype is now successfully built, demonstrating energy efficiency in a High-Performance Computing (HPC) testbed: the energy consumed for solving a given problem on this new platform is 3 to 10 times lower than what traditional HPC processors of the same time generation consume for solving the same problem. The substantial prototype has been validated through the execution of full HPC applications from materials science, climate forecasting, computational fluid dynamics, astrophysics, neuroscience, and a database.” [READ MORE…]
Applying Cloud Techniques to Address Complexity in HPC System Integrations
Arno Kolster from Providentia Worldwide gave this talk at the HPC User Forum. “OLCF and technology consulting company Providentia Worldwide recently collaborated to develop an intelligence system that combines real-time updates from the IBM AC922 Summit supercomputer with local weather and operational data from its adjacent cooling plant, with the goal of optimizing Summit’s energy efficiency. The OLCF proposed the idea and provided facility data, and Providentia developed a scalable platform to integrate and analyze the data.” [READ MORE…]
Video: The Cray Shasta Architecture
In this video from the HPC User Forum at Argonne, Steve Scott from Cray presents: The Cray Shasta Architecture. The DOE has selected the Shasta architecture to power all three of their planned Exascale systems coming to Argonne, ORNL, and LLNL. “Shasta allows for multiple processor and accelerator architectures and a choice of system interconnect technologies, including our new Cray-designed and developed interconnect we call Slingshot.” [READ MORE…]
TACC Unveils Frontera – Fastest Supercomputer in Academia
Today TACC unveiled Frontera, the 5th most powerful supercomputer in the world. “Frontera has been supporting science applications since June and has already enabled more than three dozen teams to conduct research on a range of topics from black hole physics to climate modeling to drug design, employing simulation, data analysis, and artificial intelligence at a scale not previously possible.” [READ MORE…]
