Sign up for our newsletter and get the latest HPC news and analysis.
Send me information from insideHPC:


OFA Expands Mission to Boost Development of Advanced Network and Fabric Technologies

Today the OpenFabrics Alliance (OFA) unveiled an expanded mission to accelerate the development and adoption of advanced fabric technologies. This is a significant expansion of its original mission from 2004, which was to facilitate the rapid adoption of an emerging network technology, known as the InfiniBand Architecture. The new mission expands its scope to include software for the entirety of the advanced networks landscape, including the InfiniBand Architecture. ”
The 15th Annual OFA Workshop, is returning to Austin, Texas – March 19-21, 2019 at the University of Texas at Austin.”

Intel to Host IXPUG eXtreme Performance User Group Sept. 25-28 in Oregon

Intel will host the Intel eXtreme Performance User Group (IXPUG) event Sept. 25-28 in Hillsboro, Oregon. “This IXPUG conference is focused on all aspects of employing and adopting many-core processing technologies and techniques for optimal application execution, including topics that cover system hardware beyond the processor (memory, interconnect, etc.), software tools, programming models, new workloads (visualization, data analytics, machine learning, etc.) and more. The conference will provide an interactive experience focused on key topics associated with high-performance computing, artificial intelligence, data analytics, cloud computing, and more.”

OSS Brings ATTO 32 Gb Fibre Channel to Ion Accelerator Flash Storage Array

Today One Stop Systems introduced an ATTO Technology 32 Gb (gigabit) Fibre Channel option for its Ion Accelerator 5.0 Flash Storage Array product line. “ATTO designs some of the best, most reliable and fastest Fibre Channel host bus adapters on the market today,” said Steve Cooper, CEO of OSS. “In partnership with ATTO, we’re excited to offer Ion Accelerator customers the most advanced interconnect technology for accelerating their HPC applications.”

Mellanox Rolls Out World’s Fastest Ethernet Storage Fabric Controller

Today Mellanox rolled out new BlueField-based storage controllers, offering “ultra-high performance” for Ethernet Storage Fabrics. “These BlueField storage controllers tightly-integrate flash connectivity, networking, and Arm processors to maximize performance and efficiency, while eliminating the need for a separate CPU in storage and hyperconverged appliances. This makes them perfect for connecting and virtualizing the fastest non-volatile storage.”

DARPA Selects Research Projects for Next-Gen Processing Technology

DARPA (Defense Advanced Research Projects Agency) has announced the academic and industry research groups selected to develop new computing technologies to drive computing performance post Moore’s Law. “These projects hope to overcome one of the fundamental performance bottlenecks facing HPC users the ‘memory bottleneck’. By setting researchers the task of investigating vertical, rather than flat or planar integration of microsystem components—as well as new materials, components, and algorithms capable of closing the gap between memory and logic functions—the program managers leading the 3DSoC and FRANC programs hope to create new means of computing vast amounts of information.”

Optimizing Performance with the Dell EMC AI & HPC Innovation Lab

In this video from the Dell EMC HPC Community meeting, Onur Celebioglu describes his work at the Dell EMC AI & HPC Innovation Lab. “Bringing together HPC operational excellence and expertise, it is staffed by a dedicated group of computer scientists, engineers and Ph.D. subject matter experts who actively partner and collaborate with customers and other members of the HPC community. The team gets early access to new technologies, integrates and tunes high‐performance compute clusters, benchmarks applications, develops best practices, and publishes white papers.”

How Red Hat Powers the #1 Summit Supercomputer

In this video from ISC 2018, Yan Fisher from Red Hat and Buddy Bland from ORNL discuss Summit, the world’s fastest supercomputer. Red Hat teamed with IBM, Mellanox, and NVIDIA to provide users with a new level of performance for HPC and AI workloads. ”
But the rapid innovation showcased by Summit must be consumable, and that’s where Red Hat Enterprise Linux comes in. Despite the scale, processing capability, and “intelligence” of Summit’s composition, end users interact with something they understand: Linux, in the form of the world’s leading enterprise Linux platform. Red Hat Enterprise Linux provides a common, stable basis that ties together all of this innovation.”

HPC AI Advisory Council Conference Returns to Perth Aug. 28-29

The HPC Advisory Council has posted the Agenda for their upcoming meeting in Perth, Australia. Hosted by the Pawsey Supercomputing Centre, the event takes place August 28-29. “The Conference highlights Western Australia’s relevance and key role in delivering scientific breakthroughs for the benefit of humanity through leading centres like Pawsey.”

Dell EMC Gains Momentum on HPC & AI at ISC 2018

In this video from ISC 2018, Thierry Pelligrino from Dell EMC describes how the company is moving forward with HPC and AI solutions for customers in science, engineering, and the Enterprise. “HPC is great practice. AI is the buzzword. But the two need to come together. You can’t really get value out of your data if you don’t know how to use the highest performing computing cycles. You also need to think about how you use the data in storage and how you make it move around with a lot of networking gear.”

PLDA and HPE to Develop Gen-Z semiconductor IP

Today Hewlett Packard Enterprise and PLDA announced a joint collaboration to meet the challenges of next-generation connectivity for advanced workloads. Gen-Z is a new open interconnect protocol and connector developed by the Gen-Z Consortium to solve the challenges associated with processing and analyzing huge amounts of data in real time. HPE and PLDA are working together to develop Gen-Z semiconductor IP designed to the Gen-Z Core Specification 1.0. “PLDA is proud to collaborate with HPE to provide comprehensive design IP to silicon providers to enable volume production of Gen-Z compatible components and to enable system vendors to utilize the Gen-Z silicon components to build network, storage and compute systems and solutions,” said Arnaud Schleich, CEO, at PLDA. “This will enable an open ecosystem of Gen-Z building blocks for a variety of solutions from the intelligent edge to the cloud.”