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MLCommons Releases MLPerf Inference v1.1 Results 

San Francisco – September 22, 2021 – Today, MLCommons, an open engineering consortium, released new results for MLPerf Inference v1.1, the organization’s machine learning inference performance benchmark suite. MLPerf Inference measures the performance of applying a trained machine learning model to new data for a wide variety of applications and form factors, and optionally includes […]

LLNL Reports on Inaugural ML for Industry Forum

LLNL held its first-ever Machine Learning for Industry Forum (ML4I) on Aug. 10-12. Co-hosted by the Lab’s High Performance Computing Innovation Center (HPCIC) and Data Science Institute (DSI), the virtual event brought together more than 500 participants from the Department of Energy (DOE) complex, commercial companies, professional societies and academia. Industry sponsors included ArcelorMittal, Cerebras Systems, Ford Motor Company, […]

Cerebras Alliance Offers CS-2 AI Supercomputer as Cloud Service

High performance AI chip maker Cerebras, maker of the Wafer-Scale Engine, the world’s largest computer chip, today announced Cerebras Cloud @ Cirrascale, delivering its AI accelerator as a cloud service. The alliance combines Cerebras’s CS-2 HPC/AI system, featuring 850,000 AI-optimized compute cores, with Cirrascale’s deep learning cloud services infrastructure. “With Cerebras Cloud @ Cirrascale, (the […]

Human Brain Project’s EBRAINS Shares Laptop-to-Supercomputer Brain Simulator

EBRAINS, a new digital research infrastructure set up by the EU-funded Human Brain Project, has made available a brain simulation software, called NEST 3, for use in fields such as neuroscience and robotics. NEST 3 is designed to enable a better representation of entire populations of neurons and to optimize simulator performance. “NEST 3 boosts […]

CoolIT Systems Launches High-Density HPC and HCI Servers with Gigabyte

Calgary, Alberta. September 16, 2021 – CoolIT Systems Inc., a maker of modular, scalable data center liquid cooling technology, has announced a joint product launch with GIGABYTE Technology, maker of high-performance servers and workstations. Two high-density servers, H262-ZL0 and H262-ZL2, will be equipped with direct liquid cooling for CPUs and more from CoolIT Systems. These cooling […]

ALCF, IIT Team Develops Benchmark for Scientific Deep Learning Efficiency

The emergence of deep learning techniques has provided a new tool for accelerating scientific exploration and discoveries. A group of researchers from the Argonne Leadership Computing Facility (ALCF) and the Illinois Institute of Technology (IIT) set out to improve the efficiency of deep learning-driven research by developing a new benchmark, named DLIO, to investigate the […]

HPC/AI in the Spotlight: Jensen Huang Named to Time Magazine’s Most Influential People List

Estranged royalty, movie stars and Olympic athletes have influence, sure, but if you want to build a list of people with lasting impact then Time magazine got it right when it named Jensen Huang to its list of the 100 most influential people of 2021. The CEO of Nvidia, whose GPUs are highlighted by Time […]

Arqit and Juniper Networks in Alliance to Address Quantum Security Threats to Networks

London – September 15, 2021 – Arqit Quantum Inc. (“Arqit”), developer of quantum encryption technology and Juniper Networks, maker of AI-driven networks, have signed a ‘Technology Alliance Partner Connect’ agreement to explore network security technology that will protect against quantum security threats. Cyber-attackers regularly target networks to disrupt business operations. Arqit and Juniper will explore how network […]

Sandia: New 3D-imaging Workflow Could Certify HPC Materials Simulations

ALBUQUERQUE, N.M. — Sandia National Laboratories researchers have announced they have created a method of processing 3D images for computer simulations that could have beneficial implications for several industries, including health care, manufacturing and electric vehicles. At Sandia, the method could prove vital in certifying the credibility of high-performance computer (HPC) simulations used in determining […]

Amphenol: 112Gb/s Interconnect with eTopus Products for IP Solutions

San Jose, Sept. 14, 2021 – Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today announced the development of a 112Gb/s interconnect technology built on their products. This combined solution is […]