IBM in $137M Semiconductor Agreement with Canada

BROMONT, QC, April 26, 2024 — IBM, the government of Canada and the government of Quebec today announced agreements to develop the assembly, testing and packaging (ATP) capabilities for semiconductor modules for telecommunications, high performance computing (HPC), automotive, aerospace and defence, computer networks and generative AI, at IBM Canada’s plant in Bromont, Quebec. The agreements reflect […]

TSMC in the USA: Up to $6.6B in CHIPS Act Funding for 3rd (2nm or More) Arizona Fab

TSMC announced it has signed a preliminary agreement with the U.S. Dept. of Commerce for up to $6.6 billion under the CHIPS and Science Act. TSMC also announced plans to build a third fab at its TSMC Arizona site in  Phoenix using 2nm or more processes….

HPC News Bytes: IndiaAI Mission, New Fabs around the World, Atos-Eviden

A happy mid-March day to you. Last week in the world of HPC-AI the emphasis was on the latter, including: the expanding IndiaAI Mission will include a 10,000-GPU supercomputer, TSMC’s biggest customers, countries court chip manufacturers for local fabs….

HPC News Bytes 20240304: GPU Scarcity, Global Fab Capacity Boost, AI Hurdles and Singapore’s AI Training Strategy (Including Mid-Careerists)

A good March morning to you! Forthwith is a fast (5:51) run-though of recent HPC-AI news, including: The GPU shortage; HPE, Dell financial results, GPU allocations, new Intel fabs….

HPC News Bytes 20240226: Intel Foundry Bash, Nvidia Earnings and AI Inference, HPC in Space, ISC 2024

A happy Monday of Leap Year Week to you! We offer a rapid run-through of the latest in HPC-AI, including: Intel Foundry bash, Gelsinger talks up the “Systems Foundry Era,” Wall Street hangs on Nvidia earnings, AI Training vs Inference, Digitial In-Memory Computing for inference efficiency, HPC in space, ISC 2024.

Samsung Collaborates with Arm on Cortex-X CPU

SAN JOSE, Feb 20, 2024 – Samsung Electronics Co., Ltd. today announced a collaboration to deliver Arm Cortex-X CPU developed on Samsung Foundry’s Gate-All-Around (GAA) process technology. This initiative is built on a partnership with devices shipped with Arm CPU intellectual property on various process nodes offered by Samsung Foundry. This collaboration will lead to […]

HPC News Bytes 20240212: Honda Taps Cadence CFD HPC, Chip Industry Gyrations, Yelick in ISC Spotlight

Good day-after-Super-Bowl morning to you! It was an interesting week in HPC-AI last week, here’s a quick (5:47) run through some of the latest goings on: Honda taps Cadence supercomputer for air taxi R&D, chip industry gyrations, Kathy Yelick to deliver ISC 2024 keynote, Google settles patent infringement case….

Chip War: Banned NVIDIA GPUs Trickle into China, TSMC Shares Jump on AI

The advanced chips sector and its geopolitical significance is in the news this week as a Reuters story reports that “Chinese military bodies, state-run artificial intelligence research institutes and universities have over the past year purchased small batches of NVIDIA semiconductors,” including….

HPC News Bytes 20240108: Ericsson and the Intel 4 Process, AI and VC in 2023, Samsung and CXL for RHEL, Quantum Cybersecurity

A good January morning to you! Here’s a brief (5:14) run-down of goings-on in HPC-AI: Ericsson may beat Intel to the Intel 4 process punch, AI a bright spot on 2023 venture landscape, Samsung optimizes CXL for RHEL, new quantum cybersecurity reearch.

Call for Papers: Ken Kennedy Institute Energy HPC Conference, Jan. 15 Deadline

The 17th Annual Energy High Performance Computing Conference hosted by the Ken Kennedy Institute at Rice University, to be held March 5-7, 2024, has issued an invitation to submit an abstract for presentation. The deadline is Monday, January 15, 2024 at 11:59 PM CT. ​Abstract submission information can be found here. Conference organizers invite prospective speakers […]