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Lockheed Martin, Ayar Labs Partner on Microchip Connectivity for Sensory Systems

BETHESDA, Md. and SANTA CLARA, Calif. – Lockheed Martin, (NYSE: LMT) and Ayar Labs, a leader in chip-to-chip optical connectivity, today announced a strategic collaboration to develop future sensory platforms that leverage Ayar Labs’ advanced optical I/O microchips that use light to transfer data faster, at a lower latency, and at a fraction of the […]

Cadence Announces AI-Driven EDA Verification Platform

SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the Cadence Verisium AI-driven verification platform, a suite of applications leveraging big data and AI designed to optimize verification workloads, boost coverage and accelerate root cause analysis of bugs. The Verisium platform is built on the new Cadence Joint Enterprise Data and AI (JedAI) […]

Seeking a Piece of $50B CHIPS Act Funds? Commerce Department Launches ‘CHIPS.gov’

The U.S. Commerce Department announced yesterday the CHIPS.gov website that includes implementation information for the recently passed CHIPS and Science Act. The site is intended for organizations seeking funds from the $50 billion for manufacturing, research and development funds allocated by the bill. In addition, the White House announced an interagency CHIPS Implementation Steering Council. […]

HPC4EI to Celebrate National Manufacturing Day Oct. 7 with Virtual Event

On Friday, Oct. 7, the Department of Energy’s High Performance Computing for Energy Innovation (HPC4EI) will hold a free virtual event entitled “Computational Science Supports Energy Initiatives” from 8 am to 2:15 pm Pactific Time. Registration is here. HPC4EI is intended to pair industry partners with computational scientists at the DOE national laboratories to increase […]

@HPCpodcast: CXL News, the CHIPS Act, Chips and Nm and Chip ‘Sprawl’

We’ve heard so much about the CXL interconnect – including the recent announcement of CXL v3.0 – and components that are CXL-ready, that it may come as a surprise that CXL v1.1 “hosts” are only just now shipping. It’s a technology that could play a central role in the ever-more heterogenous, more memory-intensive systems of the future. And now, after several years of experimentation and various interconnect consortia, CXL is emerging as the standard for advanced functionality for fabric technologies. Along with CXL we also discuss some of the details of the CHIPS and Science Act….

Report: US Pressures Netherlands on Exports of ASML Chip Equipment to China

Dutch semiconductor equipment maker ASML’s wunderkind chip manufacturing technology has become embroiled in the technology trade war between the United States and China, according to a Bloomberg story.  The U.S. is pressuring officials in The Netherlands to block ASML from selling older deep ultraviolet lithography (DUV) systems to China while also attempting to persuade Japan […]

TSMC Japan 3DIC R&D Center Completes Clean Room Construction in AIST Tsukuba Center

IBARAKI, Japan, June 24, 2022 — TSMC (TWSE: 2330, NYSE: TSM) today announced that its subsidiary, the TSMC Japan 3DIC R&D Center, has completed construction of its clean room in the Tsukuba Center of the National Institute of Advanced Industrial Science and Technology (AIST). An opening event was held today. The TSMC Japan 3DIC R&D […]

AMD to Use AMD EPYC-Powered Google Cloud’s C2D VM Instance for EDA

Google Cloud and AMD today announced a partnership in which AMD will run electronic design automation (EDA) for its chip-design workloads on Google Cloud, extending the on-premises capabilities of AMD data centers. AMD will also leverage Google Cloud’s global networking, storage, artificial intelligence, and machine learning capabilities to improve upon its hybrid and multicloud strategy […]

HPE to Build HPC and AI Systems Factory in Czech Republic

Hewlett Packard Enterprise (NYSE: HPE) today announced plans to build its first factory in Europe for high performance computing (HPC) and artificial intelligence (AI) systems. The company said the dedicated HPC factory, the fourth such site globally, will be located in Kutná Hora, Czech Republic, next to HPE’s existing European site for manufacturing servers and […]

Tesla: Cooling Tech Engineer Stole Dojo Exascale Supercomputer Secrets

Theft of secret information about Tesla’s in-house supercomputer, the exascale-class “Project Dojo” system due to be up and running this year,  are at issue in a suit filed by the company against an HPC cooling technology engineer and former employee who joined Tesla in January and resigned this month. According to a story by Bloomberg […]