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Intel Delivers 17-Qubit Superconducting Chip with Advanced Packaging to QuTech

Today, Intel announced the delivery of a 17-qubit superconducting test chip for quantum computing to QuTech, Intel’s quantum research partner in the Netherlands. The new chip was fabricated by Intel and features a unique design to achieve improved yield and performance. “Our quantum research has progressed to the point where our partner QuTech is simulating quantum algorithm workloads, and Intel is fabricating new qubit test chips on a regular basis in our leading-edge manufacturing facilities.”

COMSOL Conference Showcases Next-Gen Multiphysics

Attendees of the COMSOL Conference in Boston this week were treated to a sneak preview future developments of the popular multiphysics software from Svante Littmarck, President and CEO of COMSOL. The conference featured a robust technical program with approximately 300 attendees. “Our customers are at the forefront of innovation behind the products that will shape our future,” says Littmarck. “We work tirelessly to support their efforts by increasing the modeling power of the COMSOL software and by making collaboration among simulation experts and their colleagues the core of everything we do. This annual event is our opportunity to connect and exchange knowledge within the COMSOL community on multiphysics modeling.”

Mapping of the Opportunities for Government, Academia, and Industry Engagement in HPC

Mark Sims (DoD) and Bob Sorensen from Hyperion Research gave this talk at the HPC User Forum in Milwaukee. Here, they demonstrate an exciting new tool that aims to map HPC centers across the USA.

Call For Research Papers: ISC 2018

ISC 2018 has issued their Call for Research Papers. “Submissions are now open for the ISC 2018 conference research paper sessions, which aim to provide first-class opportunities for engineers and scientists in academia, industry, and government to present and discuss issues, trends, and results that will shape the future of high performance computing. Submissions will be accepted through Dec. 22, 2017. The research paper sessions will be held from Monday, June 25, through Wednesday, June 27, 2018.”

Parallel Applications Speed Up Manufacturing Product Development

The product design process has undergone a significant transformation with the availability of supercomputing power at traditional workstation prices. With over 100 threads available to an application in compact 2 socket servers, scalability of applications that are used as part of the product design and development process are just a keyboard away for a wide range of engineers.

Clemson to complete $1 million upgrade of Palmetto HPC Cluster

A $1-million upgrade to Clemson University’s Palmetto Cluster is expected to help researchers quicken the pace of scientific discovery and technological innovation in a broad range of fields, from developing new medicines to creating advanced materials. “New hardware that could be in place as early as spring will add even more power to the Palmetto Cluster. Even before the upgrade, it rated eighth in the nation among academic supercomputers, according to the twice-annual TOP500 list of the world’s most powerful computers.”

HPC Powers High Pressure Casting Simulation at Shiloh Industries

Hal Gerber from Shiloh Industries gave this talk at the HPC User Forum in Milwaukee. “Shiloh is the global leader in high-integrity, high-vacuum, high-pressure die castings, providing high ductility in aluminum and magnesium. Shiloh Industries is a global innovative solutions provider focusing on “lightweighting” technologies that provide environmental and safety benefits to the mobility market.”

HPC4Mfg Program Seeks New Projects

The High Performance Computing for Manufacturing (HPC4Mfg) program in the Energy Department’s Advanced Manufacturing Office (AMO) announced today their intent to issue their fifth solicitation in January 2018 to fund projects that allow manufacturers to use high-performance computing resources at the Department of Energy’s national laboratories to tackle major manufacturing challenges.

LANL Steps Up to HPC for Materials Program

“Understanding and predicting material performance under extreme environments is a foundational capability at Los Alamos,” said David Teter, Materials Science and Technology division leader at Los Alamos. “We are well suited to apply our extensive materials capabilities and our high-performance computing resources to industrial challenges in extreme environment materials, as this program will better help U.S. industry compete in a global market.”

Video: Will HPC Move to the Cloud?

Gabriel Broner from Rescale gave this talk at the HPC User Forum. “HPC has transitioned from unique and proprietary designs, to clusters of many dual-CPU Intel nodes. Vendors’ products are now differentiated more by packaging, density, and cooling than the uniqueness of the architecture. In parallel, cloud computing has gained momentum in the larger IT industry. Intel is now selling more processors to run in the cloud than in company-owned facilities, and cloud is starting to drive innovation and efficiencies at a rate faster than on premises.”