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HPC4Mfg Program Seeks New Projects

The High Performance Computing for Manufacturing (HPC4Mfg) program in the Energy Department’s Advanced Manufacturing Office (AMO) announced today their intent to issue their fifth solicitation in January 2018 to fund projects that allow manufacturers to use high-performance computing resources at the Department of Energy’s national laboratories to tackle major manufacturing challenges.

LANL Steps Up to HPC for Materials Program

“Understanding and predicting material performance under extreme environments is a foundational capability at Los Alamos,” said David Teter, Materials Science and Technology division leader at Los Alamos. “We are well suited to apply our extensive materials capabilities and our high-performance computing resources to industrial challenges in extreme environment materials, as this program will better help U.S. industry compete in a global market.”

Video: Will HPC Move to the Cloud?

Gabriel Broner from Rescale gave this talk at the HPC User Forum. “HPC has transitioned from unique and proprietary designs, to clusters of many dual-CPU Intel nodes. Vendors’ products are now differentiated more by packaging, density, and cooling than the uniqueness of the architecture. In parallel, cloud computing has gained momentum in the larger IT industry. Intel is now selling more processors to run in the cloud than in company-owned facilities, and cloud is starting to drive innovation and efficiencies at a rate faster than on premises.”

New HPC for Materials Program to Help American Industry

Earlier this week, U.S. Secretary of Energy Rick Perry announced a new high-performance computing initiative that will help U.S. industry accelerate the development of new or improved materials for use in severe environments. “The High Performance Computing for Materials Program will provide opportunities for our industry partners to access the high-performance computing capabilities and expertise of DOE’s national labs as they work to create and improve technologies that combat extreme conditions,” said Secretary Perry.

HPE to Bundle Altair PBS Pro Workload Manager

Today Altair announced a multi-year original equipment manufacturing (OEM) agreement with HPE. This agreement represents an expansion of the long-term partnership between HPE and SGI (whom HPE recently acquired). HPE will now be able to include Altair’s PBS Professional workload manager and job scheduler on all of HPE’s high performance computing (HPC) systems, ensuring scalability of price and performance as system sizes and CPU-core counts continue to increase.

Northrop Grumman to Acquire Orbital ATK for $9.2 Billion

Today Northrop Grumman Corporation announced they have entered into a definitive agreement to acquire Orbital ATK for approximately $7.8 billion in cash, plus the assumption of $1.4 billion in net debt. “Through our combination, customers will benefit from expanded capabilities, accelerated innovation and greater competition in critical global security domains. Our complementary portfolios and technology-focused cultures will yield significant value creation through revenue synergies associated with new opportunities, cost savings, operational synergies, and enhanced growth.”

SC17 Invited Talk to Look at Computing with Physics

SC17 continues their series of Session Previews with discussion with Dr. Catherine Graves from HP Labs about her upcoming Invited Talk. “I will present our work implementing a prototype hardware accelerator dot product engine (DPE) for vector-matrix multiplication (VMM). VMM is a bottleneck for many applications, particularly in neural networks, and can be performed in the analog domain using Ohm’s law for multiplication and Kirchoff’s current law for summation.”

Entering the Era of Simulation Driven Design

In this special guest feature, Robert Roe from Scientific Computing World reports from the European Altair Technology Conference and finds that simulation-driven design is taking center stage for the CAE industry. “Jim Scapa from Altair noted that Scapa noted that big data and the cloud will continue to play a significant role in the development and consumption of software and that manufacturing methods and materials science would continue to drive innovations – particularly in areas such as additive manufacturing and the design of composites.”

Video: Best Practices between HPC centers and Industrial Users

Bill Kramer from NCSA gave this talk at the HPC User Forum in Milwaukee. “NCSA and Hyperion Research released a new study that examines HPC and Industry partnerships. Aimed at identifying and understanding best practices in partnerships between public high performance computing centers and private industry, the study aims to promote the vital transfer of scientific knowledge to industry and the important transfer of industrial experience to the scientific community.”

CCIX Project to link ARM Processors and FPGAs for HPC

Today ARM, Xilinx, Cadence, and Taiwan Semiconductor announced plans to produce the first test chip for the Cache Coherent Interconnect for Accelerators (CCIX) project. CCIX (pronounced “C6”) aims to prove that many-core ARM processors linked to FPGAs have a home in HPC. “The test chip will not only demonstrate how the latest Arm technology with coherent multichip accelerators can scale across the data center, but reinforces our commitment to solving the challenge of accessing data quickly and easily.”