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TSMC Holds 3nm Chip Ceremony in Taiwan, 2nm on Way

HSINCHU, Taiwan, R.O.C. – TSMC (TWSE: 2330, NYSE: TSM) held a 3 nanometer (3nm) volume production and capacity expansion ceremony on December 29 at its Fab 18 construction site in the Southern Taiwan Science Park (STSP), bringing together suppliers, construction partners, central and local government, the Taiwan Semiconductor Industry Association, and member of academia to witness an […]

TSMC’s $40B US Investment: 4nm Fab Hitting Snags, 3nm Plant Construction Has Begun

(Editor’s Note: This story, originally published on Dec. 5, was updated on Dec. 6.) Pointing to high costs and a US skills shortage, Taiwanese chip manufacturer TSMC has reported challenges to the completion by next December of its new 4 nanometer semiconductor plant north of Phoenix, according to a story in The Wall Street Journal on Dec. 5. “The $12 billion Arizona semiconductor plant under construction that President Biden is visiting Tuesday represents U.S. hopes for a renaissance in manufacturing, but the Taiwanese company building it says it won’t be easy,” the Journal article stated. “High costs, lack of trained personnel and unexpected construction snags are among the issues cited by Taiwan Semiconductor Manufacturing Co.  as it rushes to get the north Phoenix factory ready to start production in December 2023.”

inside HPC-Hyperion Research Interview: TSMC Explains Why HPC Is Its Fastest Growing Market, the Path to 3nm Chips and What’s Coming up from the Company

In this exclusive interview, conducted on behalf of HPC industry analyst firm Hyperion Research, we talk with Yujun Li, director of HPC business development for the Taiwan Semiconductor Manufacturing Company (TSMC), one of the most advanced chip manufacturers in the world, whose customers include AMD, NVIDIA – and Intel. Li amplifies TSMC’s public statements that HPC is the company’s fastest growing market segment, discusses TSMC’s HPC chip strategies and fab expansion and its 5 nanometer and 3nm plans.