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Cerebras Claims Record for Largest AI Models Trained on a Single Device

SUNNYVALE, Calif., June 22, 2022 — AI computing company Cerebras Systems today announced that  a single Cerebras CS-2 system is able to train models with up to 20 billion parameters on – something not possible on any other single device, according to the company. By enabling a single CS-2 to train these models, Cerebras said […]

TSMC Debuts FINFLEX, N2 Process

SANTA CLARA, CA, Jun. 16, 2022 – TSMC today showcased its advanced logic, specialty and 3D IC technologies at the company’s 2022 North America Technology Symposium, with the next-generation N2 process utilizing nanosheet transistors and the FINFLEX technology for the N3 and N3E processes making their debuts. Highlighted at the symposium: TSMC’s N3 technology, set […]

Avery Design Systems Announces Verification Support for New Chiplet Interconnect Standard

Tewksbury, MA – June 15, 2022 – Avery Design Systems, a functional verification solutions company, today announced its support for the new UCIe (Universal Chiplet Interconnect Express) standard, providing an efficient approach to enable design and verification engineers to leverage the recently-introduced standard for die-to-die interface connectivity. Avery’s offering includes models and test suites that support […]

Report: Worsening Supply Chain, Fab Equipment Problems for TSMC and Samsung Could Hit HPC and AI

To the combination of economic and geopolitical forces generating high global inflation and rising recession expectations can be included the continuing shortage of microprocessors that, according to a story in the Wall Street Journal, could directly impact on advanced chips, including those used in HPC and AI. While the chip shortage is not new, its […]

inside HPC-Hyperion Research Interview: TSMC Explains Why HPC Is Its Fastest Growing Market, the Path to 3nm Chips and What’s Coming up from the Company

In this exclusive interview, conducted on behalf of HPC industry analyst firm Hyperion Research, we talk with Yujun Li, director of HPC business development for the Taiwan Semiconductor Manufacturing Company (TSMC), one of the most advanced chip manufacturers in the world, whose customers include AMD, NVIDIA – and Intel. Li amplifies TSMC’s public statements that HPC is the company’s fastest growing market segment, discusses TSMC’s HPC chip strategies and fab expansion and its 5 nanometer and 3nm plans.

GIGABYTE Releases Arm-Based Server for NVIDIA Baseboard Accelerators for HPC, AI

May 19, 2022 – GIGABYTE Technology, (TWSE: 2376), maker of high-performance servers and workstations, today announced a scalable server, G492-PD0, that supports dual Ampere Altra Max or Altra processors with NVIDIA HGX A100 Tensor Core GPUs for cloud infrastructure, HPC, AI and other high performance environments. “Leveraging Ampere’s Altra Max CPU with a high core […]

AMD to Use AMD EPYC-Powered Google Cloud’s C2D VM Instance for EDA

Google Cloud and AMD today announced a partnership in which AMD will run electronic design automation (EDA) for its chip-design workloads on Google Cloud, extending the on-premises capabilities of AMD data centers. AMD will also leverage Google Cloud’s global networking, storage, artificial intelligence, and machine learning capabilities to improve upon its hybrid and multicloud strategy […]

Proposals Open to Research Community for ALCF AI Testbed’s Cerebras and SambaNova Systems

Proposals are now being accepted by the Argonne Leadership Computing Facility for access to its AI Testbed, a collection of advanced artificial intelligence accelerators available for science. Researchers interested in using the AI Testbed’s Cerebras CS-2 and SambaNova DataScale systems can submit project proposals via the ALCF’s Director’s Discretionary program. Access to additional testbed resources, including Graphcore, Groq, and Habana accelerators, will be […]

More ‘EPYC’ Options for HPC

[SPONSORED CONTENT]  High performance computing (HPC) often sets trends for the data center. Driving innovation, adding new functionality, and enabling simulations to deliver more accuracy, finer details, and insights. Recently AMD released four new AMD EPYC™ 7003 Series processors with AMD 3D V-Cache™ technology. Socket compatible with existing EPYC 7003 processors, the AMD 3D V-Cache […]

World Quantum Day: Intel and QuTech Collaborate on Silicon Qubits

April 14, 2022 — Researchers at Intel and QuTech, an advanced quantum computing research center consisting of the Delft University of Technology (TU Delft) and the Netherlands Organization for Applied Scientific Research (TNO), report they have successfully created the first silicon qubits at scale at Intel’s D1 manufacturing factory in Hillsboro, Oregon. The result is […]