At its Foundry Forum today in San Jose, Samsung Electronics spotlighted its foundry business strategy with emphasis on high performance computing (HPC), artificial intelligence (AI), 5/6G connectivity and automotive applications. A featured announcement: Samsung committed to bringing 1.4-nanometer (nm), for production in 2027. That will be preceded by the introduction of 2nm process in 2025 […]
Supermicro Announces 8U ‘Universal GPU’ Server for NVIDIA H100’s
September 13, 2022 by
HPC-AI server maker Supermicro today announced what the company said is its most advanced GPU server incorporating eight NVIDIA H100 Tensor Core GPUs. Supermicro now offers three Universal GPU servers: the 4U, 5U and the new 8U. The Universal GPU platforms also support Intel and AMD CPUs up to 400W, 350W and higher, according to […]
Lenovo HPC Powers SPEChpc™ 2021 with AMD 3rd Generation EPYC™ Processors
August 31, 2022 by
As a leader in high performance computing, Lenovo continually supports the Standard Performance Evaluation Corporation (SPEC) benchmarks, that would help customers make better-informed decisions for their HPC workloads. SPEChpc™ 2021 is a newly released benchmark suite from SPEC that produces industry-standard benchmarks for the newest generation of computer systems. What separates SPEChpc™ 2021 from SPEC CPU® 2017, SPEC MPI® 2007 or the other SPEC benchmark suites is that SPEChpc™ 2021 is one-of-a-kind benchmark suite which uses real-world applications that support “multiple programming models and offloading” to evaluate the performance of state-of-the-art heterogenetic HPC systems.
Untether AI Unveils At-Memory Compute Architecture at Hot Chips
August 24, 2022 by
PALO ALTO — Untether AI, an at-memory computation company for artificial intelligence (AI) workloads, today announced at the HOT CHIPS 2022 conference its next-generation architecture for accelerating AI inference workloads called speedAI devices, with an internal codename “Boqueria.” At 30 TeraFlops per watt (TFlops/W) and 2 PetaFlops of performance, the speedAI architecture sets a new […]
Ansys and AMD Team on Simulation of Large Structural Mechanical Models
August 24, 2022 by
PITTSBURGH — August 24, 2022 – Ansys (NASDAQ: ANSS) said today that Ansys Mechanical is one of the first commercial finite element analysis (FEA) programs supporting AMD Instinct accelerators, the newest data center GPUs from AMD. The AMD Instinct accelerators are designed for data centers and supercomputers to help solve complex problems. To support the AMD Instinct accelerators, Ansys […]
TSMC Issues Monthly Revenue Report
July 8, 2022 by
HSINCHU, Taiwan, R.O.C. – Jul. 8, 2022 – TSMC (TWSE: 2330, NYSE: TSM) today announced its net revenue for June 2022: On a consolidated basis, revenue for June 2022 was approximately NT$175.87 billion, a decrease of 5.3 percent from May 2022 and an increase of 18.5 percent from June 2021. Revenue for January through June […]
Cerebras Claims Record for Largest AI Models Trained on a Single Device
June 22, 2022 by
SUNNYVALE, Calif., June 22, 2022 — AI computing company Cerebras Systems today announced that a single Cerebras CS-2 system is able to train models with up to 20 billion parameters on – something not possible on any other single device, according to the company. By enabling a single CS-2 to train these models, Cerebras said […]
TSMC Debuts FINFLEX, N2 Process
June 16, 2022 by
SANTA CLARA, CA, Jun. 16, 2022 – TSMC today showcased its advanced logic, specialty and 3D IC technologies at the company’s 2022 North America Technology Symposium, with the next-generation N2 process utilizing nanosheet transistors and the FINFLEX technology for the N3 and N3E processes making their debuts. Highlighted at the symposium: TSMC’s N3 technology, set […]
Avery Design Systems Announces Verification Support for New Chiplet Interconnect Standard
June 15, 2022 by
Tewksbury, MA – June 15, 2022 – Avery Design Systems, a functional verification solutions company, today announced its support for the new UCIe (Universal Chiplet Interconnect Express) standard, providing an efficient approach to enable design and verification engineers to leverage the recently-introduced standard for die-to-die interface connectivity. Avery’s offering includes models and test suites that support […]
Report: Worsening Supply Chain, Fab Equipment Problems for TSMC and Samsung Could Hit HPC and AI
June 10, 2022 by
To the combination of economic and geopolitical forces generating high global inflation and rising recession expectations can be included the continuing shortage of microprocessors that, according to a story in the Wall Street Journal, could directly impact on advanced chips, including those used in HPC and AI. While the chip shortage is not new, its […]
