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The More You Scale, the Less You Pay … No, Really

Ansys Cloud, the managed cloud service provided by Ansys and enabled on Microsoft Azure, recently announced availability of 3rd Gen AMD EPYC processors with AMD 3D V-Cache with HBv3 virtual machines (VMs). The development unites three powerful catalysts of innovation — chip development, simulation, and cloud computing — to offer a more robust, three-layered approach to computing without on-premises hardware restrictions.

TSMC Issues Monthly Revenue Report

HSINCHU, Taiwan, R.O.C. – Jul. 8, 2022 – TSMC (TWSE: 2330, NYSE: TSM) today announced its net revenue for June 2022: On a consolidated basis, revenue for June 2022 was approximately NT$175.87 billion, a decrease of 5.3 percent from May 2022 and an increase of 18.5 percent from June 2021. Revenue for January through June […]

Report: US Pressures Netherlands on Exports of ASML Chip Equipment to China

Dutch semiconductor equipment maker ASML’s wunderkind chip manufacturing technology has become embroiled in the technology trade war between the United States and China, according to a Bloomberg story.  The U.S. is pressuring officials in The Netherlands to block ASML from selling older deep ultraviolet lithography (DUV) systems to China while also attempting to persuade Japan […]

TSMC Japan 3DIC R&D Center Completes Clean Room Construction in AIST Tsukuba Center

IBARAKI, Japan, June 24, 2022 — TSMC (TWSE: 2330, NYSE: TSM) today announced that its subsidiary, the TSMC Japan 3DIC R&D Center, has completed construction of its clean room in the Tsukuba Center of the National Institute of Advanced Industrial Science and Technology (AIST). An opening event was held today. The TSMC Japan 3DIC R&D […]

Cerebras Claims Record for Largest AI Models Trained on a Single Device

SUNNYVALE, Calif., June 22, 2022 — AI computing company Cerebras Systems today announced that  a single Cerebras CS-2 system is able to train models with up to 20 billion parameters on – something not possible on any other single device, according to the company. By enabling a single CS-2 to train these models, Cerebras said […]

RISC-V Announces First Specifications of 2022

Nuremberg, Germany – June 21, 2022 – RISC-V International, the open-design standards organization, announced its first four specification and extension approvals of 2022 – Efficient Trace for RISC-V (E-Trace), RISC-V Supervisor Binary Interface (SBI), RISC-V Unified Extensible Firmware Interface (UEFI) specifications, and the RISC-V Zmmul multiply-only extension. The news builds on momentum from 2021, in which 16 […]

TSMC Debuts FINFLEX, N2 Process

SANTA CLARA, CA, Jun. 16, 2022 – TSMC today showcased its advanced logic, specialty and 3D IC technologies at the company’s 2022 North America Technology Symposium, with the next-generation N2 process utilizing nanosheet transistors and the FINFLEX technology for the N3 and N3E processes making their debuts. Highlighted at the symposium: TSMC’s N3 technology, set […]

insideHPC’s Exclusive ISC 2022 Video Interviews

Check out our exclusive video interviews from the ISC 2022 conference! You can find them on the right side of our home page. They include: AMD – An update on the EPYC CPUs and Instinct GPUs powering the new no. 1 supercomputer, Frontier, which is also the first HPC system to exascale-certified, along with the […]

Two Key Considerations of a Composable Infrastructure Cluster

In this sponsored post, our friends over at Silicon Mechanics indicated that these days, they’re getting a lot of interest from clients about composable disaggregated infrastructure (CDI), including what the most critical elements are for CDI-based clusters. Successful deployments are more likely when clients understand why their design team focuses on certain areas more than others and how design decisions can impact end user experience, so this article outlines some key elements of CDI-based clusters.

It’s a Wrap! We’ll See You at ISC Next Year

[SPONSORED POST] After attending ISC, it’s safe to say that no remote conferencing or communication technology can ever replace the experience of face-to-face human interaction.  It was fantastic to engage directly with our customers and partners, sharing new platform developments and intriguing customer stories.  It is truly inspiring to hear about some of the new initiatives aimed to conquer challenges that seemed insurmountable in previous years.