Here’s a rapid (5:54) rundown of recent news from the HPC-AI sector, including: DOE and LLNL lead effort to go ‘beyond’ EUV lithography, report: ByteDance pursues chip trade sanction workaround, Microsoft’s $80B AI ….
HPC News Bytes 20250106: ‘Beyond’ EUV Lithography, China Chip Sanction Workaround, Microsoft’s $80B AI Build-Out, TSMC 2nm in 2025
January 6, 2025 by
LLNL to Lead Research on Advancing Extreme Ultraviolet Lithography
January 3, 2025 by
EUV, extreme ultraviolet lithography, is nearly completely associated with the Dutch company ASML, the only maker of EUV machines that are used by TSMC, Intel and other chip manufacturers of advanced HPC-AI chips. Now Lawerence Livermore National Laboratory has ….
HPC News Bytes: The Next New Big Thing in AI?, UALink and Optical I/O, Arm vs. Qualcomm
December 23, 2024 by
A happy holiday season to you! As we enter Christmas week, here’s a quick (6:14) run-through of recent news from the world of HPC-AI, including: long thinking AI – the next new big thing?, UALink and optical I/O – a possible next new big thing in interconnects, Arm vs. Qualcomm ….
Lambda Launches Inference API
December 13, 2024 by
Dec. 13, 2024 — AI company Lambda today announced its Inference API, which the company said enables access to LLMs through a serverless AI for “a fraction of a cent.” The company said Lambda Inference API offers low-cost, scalable AI inference with such models as Meta’s recently released Llama 3.3 70B Instruct (FP8) at $0.20 […]
@HPCpodcast Industry View: Penguin Solutions on Big HPC-AI Deployment Challenges and How to Overcome Them
December 11, 2024 by
In this “Industry View” episode of the @HPCpodcast, special guest Ryan Smith joins Shahin and Doug to discuss the vexing challenges of implementing HPC-class AI systems in a managed services model. We examine ….
Rapidus Collaborates with Cadence on 2nm Semiconductor Solutions for HPC-AI
December 11, 2024 by
TOKYO, SEMICON Japan, Dec. 10, 2024—Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced a collaboration with Cadence Design Systems, Inc. to provide co-optimized AI-driven reference design flows and a broad IP portfolio. The new collaboration will support the Rapidus 2nm gate-all-around (GAA) process and leverage the design and manufacturing benefits from its backside power delivery […]
At SC24: Valvoline Global Revs up HPC-AI Liquid Cooling with Debut in Atlanta
December 2, 2024 by
Valvoline Global has taken its engine cooling and lubrication heritage going back more than a century and announced at SC24 its HPC-AI liquid cooling debut. In this interview, we spoke with Samuel Raudales, Valvoline Global’s ….
HPC News Bytes 20241202: Do LLM’s Understand?, Agentic AI, Simulating the Universe, France Adding Reactors, TSMC 2nm Chips
December 2, 2024 by
A happy December start to you! From the world of HPC-AI, here’s a rapid (7:38) romp through recent news, including: LLMs and “emergent” understanding, collaborative Agentic AI, Frontier exascale ….
At SC24: Lenovo Update on Meeting New HPC-AI Demands — ‘From Exascale to Every Scale’
November 22, 2024 by
At SC24 this week in Atlanta, we caught up with Lenovo’s Moritz Manthey, Senior Manager of HPC Products and Solutions, for an update on Lenovo HPC-AI class servers built to address the emerging requirements for compute, data access ….
ASUS Presents Storage-Server Solutions for AI at SC24
November 20, 2024 by
Atlanta, Nov. 19, 2024 — ASUS today announced its next-generation infrastructure solutions at SC24, featuring a lineup powered by AMD and Intel, as well as liquid-cooling solutions designed to accelerate AI. By continuously pushing the limits of innovation, ASUS simplifies the complexities of AI and high-performance computing (HPC) through adaptive server solutions paired with expert cooling and software-development services, […]
