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Silicon Photonics and the Hunt for an HPC Bandwidth Bottleneck Breakthrough

[SPONSORED CONTENT]  “FLOPS are cheap, moving data is expensive.” In HPC circles this sentiment is heard often. There’s a growing sense that classical HPC systems and the advanced chips that power them are pushing up against their practical limits, that some foundational new technology is needed to build more balanced systems to achieve the next […]

Avery Design Systems Announces Verification Support for New Chiplet Interconnect Standard

Tewksbury, MA – June 15, 2022 – Avery Design Systems, a functional verification solutions company, today announced its support for the new UCIe (Universal Chiplet Interconnect Express) standard, providing an efficient approach to enable design and verification engineers to leverage the recently-introduced standard for die-to-die interface connectivity. Avery’s offering includes models and test suites that support […]

Heavyweight UCIe Consortium Launched to Standardize Chiplet Ecosystem

A consortium of tech industry heavyweights today announced the Universal Chiplet Interconnect Express (UCIe) industry consortium with a mission to establish a die-to-die interconnect standard and foster an open chiplet ecosystem. Founding members include Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing […]