In the world of HPC, moving data is a sin. That may be changing. “Just a few weeks ago, AIC announced the successful completion of a landmark, 1-petabyte transfer of data in 34 hours, during a recent test by Zettar that relied on the company’s SB122A-PH, 1U 10-bay NVMe storage server. The milestone was reached using a unique 5000-mile 100Gbps loop which is a SDN layer over a shared, production 100G network operated by the US DOE’s ESNet.”
How Zettar Transferred 1 Petabyte of Data in Just 34 Hours Using AIC Servers
June 24, 2017 by Leave a Comment
Intel® HPC Orchestrator and OpenHPC: Trends and Directions
June 20, 2017 by Leave a Comment
Sharing a common architecture, Intel® HPC Orchestrator and OpenHPC are changing the face of HPC by providing a cohesive and comprehensive system software stack. Dr. Robert Wisniewski, Chief Software Architect Extreme Scale Computing at Intel Corporation, discusses the advantages of this approach and how to leverage it to bring together HPC and the cloud.
Call for Proposals: HPC4Mfg Program has $3 Million to Boost Supercomputing in Industry
June 13, 2017 by Leave a Comment
Today the Energy Department announced up to $3 million in available support for manufacturers to use supercomputers at the department’s national laboratories to tackle major manufacturing challenges. The High Performance Computing for Manufacturing (HPC4Mfg) Program enables the use of high performance computing (HPC) expertise and resources for the manufacturing sector to address research and development challenges with HPC and investigate its use to support advanced energy and manufacturing issues. “The technologies adopted as a result of the HPC4Mfg Program can have a significant impact with potential to close the knowledge gaps in the manufacturing and energy industry,” said Mark Johnson, director of the Advanced Manufacturing Office. “This program aligns well with the technical focus areas our office is pursuing in early-stage, applied research and development.”
Cray to Offer Multi-Level Security Solutions with Leidos
June 8, 2017 by Leave a Comment
Today Cray announced a strategic alliance with Leidos to develop, market, and sell Multi-Level Security (MLS) solutions that include the Cray CS series of cluster supercomputers to Federal and commercial customers. “We look forward to working with Cray to evolve the capabilities and technologies necessary to offer innovative, robust MLS solutions,” said Keith Johnson, Leidos Defense & Intelligence chief technology officer. “We remain committed to delivering the best technology and efficiencies that directly support our customer’s most pressing requirements.”
Intel to Develop New Machine Learning and AI Platform for DARPA
June 5, 2017 by Leave a Comment
Today Intel announced that it has been selected by DARPA to collaborate on the development of a powerful new data-handling and computing platform that will leverage machine learning and other artificial intelligence (AI) techniques. “By mid-2021, the goal of HIVE is to provide a 16-node demonstration platform showcasing 1,000x performance-per-watt improvement over today’s best-in-class hardware and software for graph analytics workloads,” said Dhiraj Mallick, vice president of the Data Center Group and general manager of the Innovation Pathfinding and Architecture Group at Intel. “Intel’s interest and focus in the area may lead to earlier commercial products featuring components of this pathfinding technology much sooner.”
Nvidia Partners with Hyperscale Vendors for HGX-1 AI Reference Platform
June 5, 2017 by Leave a Comment
Last week at the Computex conference, Nvidia launched a partner program with hyperscale vendors Foxconn, Inventec, Quanta and Wistron to more rapidly meet the demands for AI cloud computing. Through the program, NVIDIA is providing each partner with early access to the NVIDIA HGX reference architecture, NVIDIA GPU computing technologies, and design guidelines. HGX is the same […]
IBM Research Alliance Paves the way for 5nm Technology
June 5, 2017 by Leave a Comment
Today IBM announced it has developed an industry-first process with its research partners to build silicon nanosheet transistors that will enable 5 nanometer chips. The details of the process will be presented at the 2017 Symposia on VLSI Technology and Circuits conference in Kyoto, Japan.
Cycle Computing’s Tim Carroll on how Dell EMC Powers Cloud HPC
June 1, 2017 by Leave a Comment
In this video from the Dell EMC HPC Community meeting, Tim Carroll from Cycle Computing describes how the company makes it easier to move big HPC workloads to the Cloud with the help of Dell EMC. “Dell EMC has embraced the notion that hybrid environments of internal and external resources will be the optimal path for customers.”
Plugfest Demonstrates Fibre Channel Capabilities for NVMe Storage
June 1, 2017 by Leave a Comment
“The successful conclusion of this event provides assurance to the FC SAN community that the draft version of the FC-NVMe standard specification combined with the NVMe fabric specifications meets the demanding performance and availability requirements of flash and NVMe storage,” said Mark Jones, president and chairman of the board, FCIA, and director, Technical Marketing and Performance, Broadcom Limited and FC-NVMe plugfest participant. “This event was also notable as providing the first multi-vendor interoperability demonstrating sustained low latency of Gen 6 32GFC port and fabric concurrency of FC-NVMe and FC, highlighting the adaptive architecture of FC that has more than 50 million installed ports in operation in the world’s leading datacenters.”
OpenMP ARB Appoints Duncan Poole and Kathryn O’Brien to its Board
May 25, 2017 by
Today the OpenMP ARB announced the appointment of Duncan Poole and Kathryn O’Brien to its Board of Directors. As industry veterans, they bring a wealth of experience to the OpenMP ARB.
