Here’s a sprint (5:16) through the latest HPC -AI news, including: NVIDIA’s big feature story in The New Yorker, the Open Benchmark Council’s TOP100 lists, Intel and TSMC’s high-end 3 nanometer fab, digital twins for hydropower at ORNL and PNNL.
HPC News Bytes 20231204: The New Yorker on NVIDIA, the Open Benchmark Council, Intel and TSMC, Digital Twins for Hydropower
December 4, 2023 by Leave a Comment
HPC News Bytes 20231016: China and 300eFLOPS, Samsung’s 3nm Order, Exascale Day, Women and Coding, the Coming GPU Battle
October 16, 2023 by Leave a Comment
A happy mid-October morning to you! Today’s HPC News Bytes podcast offers a rapid (5:08) romp through recent HPC developments, including: China’s goal of 300 exaflops in 2025; Samsung’s 3nm chip win; Exascale Day; fewer women computer scientists since 1984; the GPU competition between NVIDIA, AMD and Intel….
Report: Samsung Secures Order for 3nm Server Chips for US Company ‘Involved in HPC’
October 11, 2023 by Leave a Comment
A news story in the Korean news publication Pulse reported today that Samsung electronics has confirmed “a new order for 3-nanometer high performance server chips.” The Pulse story stated that semiconductor designer ADTechnology Co., a Korea-based design solution partner of Samsung and member of the AADP (Arm Approved….
@HPCpodcast: Who’s Winning the High-Stakes U.S-China AI Race?
January 25, 2023 by
If you’re concerned about the advanced chip competition between the U.S. and China – and who isn’t? – then this week’s @HPCpodcast guest offers much food for thought. Handel Jones, founder and CEO of the International Business Strategies consulting firm, is the author of a new book, WHEN AI RULES THE WORLD: China, The U.S., And The Race To Control A Smart Planet. He contends that China is winning the AI race in part because the leadership of the PRC regime is more competent and technically astute than some in the West may think.
TSMC Holds 3nm Chip Ceremony in Taiwan, 2nm on Way
January 2, 2023 by
HSINCHU, Taiwan, R.O.C. – TSMC (TWSE: 2330, NYSE: TSM) held a 3 nanometer (3nm) volume production and capacity expansion ceremony on December 29 at its Fab 18 construction site in the Southern Taiwan Science Park (STSP), bringing together suppliers, construction partners, central and local government, the Taiwan Semiconductor Industry Association, and member of academia to witness an […]
TSMC’s $40B US Investment: 4nm Fab Hitting Snags, 3nm Plant Construction Has Begun
December 5, 2022 by
(Editor’s Note: This story, originally published on Dec. 5, was updated on Dec. 6.) Pointing to high costs and a US skills shortage, Taiwanese chip manufacturer TSMC has reported challenges to the completion by next December of its new 4 nanometer semiconductor plant north of Phoenix, according to a story in The Wall Street Journal on Dec. 5. “The $12 billion Arizona semiconductor plant under construction that President Biden is visiting Tuesday represents U.S. hopes for a renaissance in manufacturing, but the Taiwanese company building it says it won’t be easy,” the Journal article stated. “High costs, lack of trained personnel and unexpected construction snags are among the issues cited by Taiwan Semiconductor Manufacturing Co. as it rushes to get the north Phoenix factory ready to start production in December 2023.”
