The U.S. Department of Defense today announced the award of $238 million in CHIPS and Science Act funding for eight Microelectronics Commons regional innovation hubs. This is the largest award to date under the act, which was passed in August 2022 and provides roughly $280 billion for research and manufacturing of semiconductors in the United States.
insideHPC-Hyperion Research Interview: Argonne’s Rick Stevens on the Future of Everything – U.S. Post-Exascale Strategy, AI for Science, HPC in 2040 and an Aurora Install Update
March 24, 2023 by
In this interview conducted on behalf of HPC analyst firm Hyperion Research, we spoke with Argonne National Laboratory’s Rick Stevens about the present and future of HPC. The starting point for this conversation is a presentation Stevens gave at a Hyperion event in Washington related to implementation of the CHIPS and Science Act and includes his insights on the post-exascale build-out of an integrated network of U.S. supercomputing capacity (the Integrated Research Infrastructure, or IRI). We then look at AI for science and the use of data-driven modeling and simulation, which shows the potential to deliver major performance gains for researchers….
inside HPC-Hyperion Research Interview: NSF’s Manish Parashar on the CHIPS and Science Act
March 8, 2023 by
As part of insideHPC’s series of interviews on behalf of HPC analyst firm Hyperion Research, we spoke with Manish Parashar, National Science Foundation director of the Office of Advanced Cyberinfrastructure (OAC). Our topic: the NSF’s role in the implementation of the CHIPS and Science Act, the $280 billion bill enacted last year by the U.S. government to boost domestic research and manufacturing of semiconductors. This interview is based on a presentation Parashar gave at a special Hyperion event recently held in Washington. Highlights include….
DOE and NSF to Expand Collaboration
January 25, 2023 by
Jan. 25, 2023 — Today the U.S. Department of Energy (DOE) and the National Science Foundation (NSF) signed a Memorandum of Understanding (MOU) that will continue a longstanding collaboration on scientific and engineering research and enable increased partnership. “This MOU will allow us to strengthen the partnership between DOE and NSF. It will expand the capabilities of each […]
