At HPE’s Discover Barcelona 2025 event today, the company said it is offering the AMD “Helios”AI rack-scale architecture with Ethernet, intended to speed up deployment of at-scale artificial intelligence training and inferencing for cloud service providers.
OpenAI and Broadcom to Deploy 10 GW of OpenAI-Designed AI Accelerators
October 14, 2025 by
When it comes to AI compute, the big cloud platform providers are chip-agnostic, adopting processors from the big chip companies (mostly NVIDIA) along with their own custom-designed GPUs ….
Broadcom Ships Jericho4 for Distributed AI Computing across Data Center
August 4, 2025 by
PALO ALTO, Calif., Aug. 4, 2025 — Broadcom Inc. (NASDAQ: AVGO), a semiconductor and infrastructure software company, today announced it is now shipping the Jericho4 ethernet fabric router — a platform for distributed AI infrastructure. Designed to interconnect over 1 million XPUs across multiple data centers, Jericho4 breaks through traditional scaling limits with unmatched bandwidth, […]
Broadcom Ships Tomahawk Ultra Ethernet Switch for HPC and AI
July 15, 2025 by
PALO ALTO, Calif., July 15, 2025 — Broadcom Inc. (NASDAQ:AVGO), a global leader in semiconductor and infrastructure software solutions, today announced the shipment of its breakthrough Ethernet switch — the Tomahawk Ultra. Engineered to transform the Ethernet switch for high-performance computing (HPC) and AI workloads, Tomahawk Ultra delivers industry-leading ultra-low latency, massive throughput, and lossless networking. “Tomahawk Ultra is […]
Broadcom Ships Tomahawk 6 102.4 Tbps Switch
June 4, 2025 by
PALO ALTO, Calif., June 03, 2025 — Broadcom Inc. (NASDAQ:AVGO) announced today that it is now shipping the Tomahawk 6 switch series, delivering what the company said is the first 102.4 Terabits/sec of switching capacity in a single chip – double the bandwidth of any Ethernet switch currently available on the market, according to Broadcom. […]
Report: TSMC to Operate Intel Fabs under Tentative Joint Venture
April 3, 2025 by
The online technology publication The Information reported today that Intel and Taiwan Semiconductor Manufacturing Company have reached a tentative agreement to form a joint venture in which TSMC would operate Intel’s chipmaking facilities.
News Bytes Podcast 20250303: GPUs vs. ASICs for AI Compute, DOGE and Fears at U.S. Science Agencies, Cat Qubits for AWS Quantum
March 3, 2025 by
A happy start to March to you! We offer a quick (8:28) run through recent news from the world of HPC-AI, including: GPUs versus ASICs for AI accelerated compute, DOGE-led government layoffs ….
Broadcom Delivers Industry Leading 200G/lane DSP for Gen AI Infrastructure
September 23, 2024 by
Broadcom Inc. (NASDAQ: AVGO) today announced the general availability of SianTM2, 200 Gbps per lane (200G/lane) PAM-4 DSP PHY. Sian2 features 200G/lane electrical and optical interfaces to augment the Sian DSP that supports 100 Gbps electrical and 200Gbps optical interfaces. Sian and Sian2 DSPs enable pluggable modules with 200G/lane interfaces that are foundational to connect next generation AI clusters.
Ultra Accelerator Link Group for Data Center AI Connectivity Formed: AMD, Broadcom, Cisco, Google, HPE, Intel, Meta and Microsoft
May 30, 2024 by
BEAVERTON, Ore.– AMD, Broadcom, Cisco, Google, Hewlett Packard Enterprise (HPE), Intel, Meta and Microsoft today announced they have aligned to develop a new industry standard dedicated to advancing high-speed and low latency communication for scale-up AI systems linking in data centers. Called the Ultra Accelerator Link (UALink), this initial group will define and establish an […]
Diane Bryant Named to Celestial AI Board
April 25, 2024 by
SANTA CLARA, CA – April 29, 2024 – Optical interconnect company Celestial AI today announced the appointment of Diane Bryant to the company’s board of directors effective April 11, 2024. With more than 30 years of semiconductor, AI and public and private company experience, Bryant currently serves as an independent board member at Broadcom and […]
