SANTA CLARA, Calif., Aug. 26, 2025 — OpenLight, a Photonic Application-Specific Integrated Circuit (PASIC) chip design and manufacturing company, today announced the close of its oversubscribed $34M Series A. The round is co-led by Xora Innovation and Capricorn Investment Group. Other participants include Mayfield; Juniper Networks, now part of HPE; Lam Capital, the corporate venture […]
The AI Superfactory: NVIDIA’s Multi-Data Center ‘Scale Across’ Ethernet
August 22, 2025 by
Ahead of Hot Chips 2025, NVIDIA today announced Spectrum-XGS Ethernet, a scale-across technology for combining multiple, distributed data centers into “unified, giga-scale AI super-factories.”
Terabit Ethernet: Rambus Launches Multi-Channel Engine MACsec-IP-364 (+363)
August 22, 2025 by
Aug. 21, 2025 — Rambus has introduced the Multi-Channel Engine MACsec-IP-364 (+363), built for next-generation Ethernet. The company said it delivers full line-rate MACsec and optional IPsec support for 1.6T and 3.2T Ethernet ports, offering a scalable and configurable solution for securing high-speed data traffic. Capabilities Full Line-Rate Throughput: Supports 1.6T in 3nm and 3.2T […]
Teramount Raises $50M for Optical Connectivity from AMD, Hitachi, Samsung, Koch
July 30, 2025 by
Jerusalem, July 29, 2025 — Teramount, a company focused on fiber-to-chip interconnect solutions, announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round. To meet AI’s escalating […]
NNSA Deploys Cornelis CN5000 Fabric for ‘Lynx’ Cluster at Livermore
July 24, 2025 by
Cornelis Networks announced its CN5000 is being deployed by the U.S. Department of Energy’s (DOE) National Nuclear Security Administration to power the 952-node “Lynx” cluster at Lawrence Livermore National Laboratory.
UALink Consortium Releases Ultra Accelerator Link 200G 1.0 Spec
April 8, 2025 by
Beaverton, OR – April 8, 2025 – The UALink Consortium today announced the ratification of the UALink 200G 1.0 Specification, which defines a low-latency, high-bandwidth interconnect for communication between accelerators and switches in AI computing pods. The UALink 1.0 Specification enables 200G per lane scale-up connection for up to 1,024 accelerators within an AI computing pod, delivering the […]
Optical I/O: Ayar Labs Launches 8 Tbps UCIe Optical Chiplet for AI Scale-Up Architectures
April 1, 2025 by
Optical interconnect company Ayar Labs announced the TeraPHY optical I/O chiplet, which Ayar said is the first optical Universal Chiplet Interconnect Express (UCIe), designed to maximize AI infrastructure performance and efficiency while reducing latency and power consumption.
Photonic Fabric: Celestial AI Secures $250M Series C Funding
March 11, 2025 by
SANTA CLARA, CA – March 11, 2025 – Celestial AI, creator of the Photonic Fabric optical interconnect, today announced that it has raised $250 million in its Series C1 funding round led by Fidelity Management & Research Company, bringing the total capital raised to date to more than $515 million. New investors include funds and […]
@HPCpodcast: Addison Snell on the Present and Future of HPC-AI, Quantum, DeepSeek, Interconnects, Leadership Supercomputing
February 7, 2025 by
We delve into current market sizing for HPC-AI (the conjoining of the two being a relatively new focus), a look ahead at the rest of the year and the decade, the impact of hyperscalers on AI ….
Emerald Invests in NLM Photonics Data Center Efficiency
January 29, 2025 by
SEATTLE, January 29, 2025 – Emerald, a venture capital company, has invested in NLM Photonics to help bring energy-efficient, high performance electro-optic modulation technology to AI, data centers, quantum computing, and more. Other investors include Oregon Venture Fund, Tokyo Ohka Kogyo Co., Ltd., Pack Ventures, StoryHouse Ventures, and other existing NLM investors to support NLM’s […]
