ORLANDO, FL (Jan. 5, 2026) – The IEEE Electronic Components and Technology Conference (ECTC), has extended the deadline for the Student Innovation Challenge for ECTC 2026. Six winning student teams will have the opportunity to attend ECTC 2026 with financial assistance, including travel costs up to a specified amount. Eligible participants currently enrolled in an […]
Jan. 11 Pre-registration Deadline for IEEE Electronic Components and Technology Conference Student Innovation Challenge
January 5, 2026 by Leave a Comment
Achieving AI Scale-Up Supremacy with Co-Packaged Optics
October 21, 2025 by
AI architectures are approaching an inflection point, and that is why a new generation of scale-up architectures is needed. Enabling thousands of XPUs to operate as one massive chip for trillion-parameter AI models ….
@HPCpodcast: Silicon Photonics – An Update from Prof. Keren Bergman on a Potentially Transformational Technology for Data Center Chips
October 13, 2025 by
In this episode of the @HPCpodcast, sponsored by CoolIT, we catch up with optical I/O expert and repeat guest ….
OpenLight Raises $34M for AI Data Center Photonics
August 27, 2025 by
SANTA CLARA, Calif., Aug. 26, 2025 — OpenLight, a Photonic Application-Specific Integrated Circuit (PASIC) chip design and manufacturing company, today announced the close of its oversubscribed $34M Series A. The round is co-led by Xora Innovation and Capricorn Investment Group. Other participants include Mayfield; Juniper Networks, now part of HPE; Lam Capital, the corporate venture […]
Teramount Raises $50M for Optical Connectivity from AMD, Hitachi, Samsung, Koch
July 30, 2025 by
Jerusalem, July 29, 2025 — Teramount, a company focused on fiber-to-chip interconnect solutions, announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round. To meet AI’s escalating […]
Charting the Photonic Future of AI Interconnect
July 16, 2025 by
The AI revolution has been fueled by a decade-long, million-fold increase in computational capability, driven by enhanced processor efficiency. However, interconnect bandwidth has not kept pace, leaving powerful ….
Broadcom Ships Tomahawk Ultra Ethernet Switch for HPC and AI
July 15, 2025 by
PALO ALTO, Calif., July 15, 2025 — Broadcom Inc. (NASDAQ:AVGO), a global leader in semiconductor and infrastructure software solutions, today announced the shipment of its breakthrough Ethernet switch — the Tomahawk Ultra. Engineered to transform the Ethernet switch for high-performance computing (HPC) and AI workloads, Tomahawk Ultra delivers industry-leading ultra-low latency, massive throughput, and lossless networking. “Tomahawk Ultra is […]
