A happy December 9 to you! Here’s a quick (7:23) review of news from the world of HPC-AI: Potential whys and wherefores of Pat Gelsinger exit from Intel, Marvell-AWS custom AI chip alliance, China comes out of the shadows ….
HPC News Bytes 20241209: Gelsinger’s Intel Exit, Marvell’s Rising Star, Quantum in China
December 9, 2024 by
insideHPC Vanguard: GE Aerospace’s Stephan Priebe — Pushing the Frontiers of Simulation
December 4, 2024 by
Dr. Stephan Priebe is a Senior Engineer in the Aerodynamics and Computational Fluid Dynamics Lab at GE Aerospace Research in Niskayuna, NY. He became involved with HPC and AI ….
Registration Opens for Energy HPC Conference at Rice Univ. Feb. 25-27
December 4, 2024 by
Dec. 4, 2024 — Registration is now open for the Energy High Performance Computing Conference at Rice University’s Ken Kennedy Institute in House, Tuesday-Thursday, Feb. 25-27. Registration is here. For the past 18 years, the Energy HPC Conference has been annual forum on industry needs and challenges, opportunities, and new developments at the interface of energy, […]
HPC News Bytes 20241118: On the Scene at SC24, TSMC and the CHIPS Act, Cerebras at Sandia
November 18, 2024 by
Good morning to you from SC24 in Atlanta. Here’s a quick (5:33) run-through of recent developments in the world of HPC-AI, including: The SC24 conference starts today; TSMC, the CHIPS Act and semiconductor demand; Sandia National Labs teams with Cerebras.
HPC4EI: DOE Announces $3.4M Funding Opportunity and Awards $4M for Energy Innovation Projects
November 14, 2024 by
WASHINGTON, D.C. – The U.S. Department of Energy (DOE) today announced a $4 million federal investment for 10 projects across 8 states that will harness the processing power of the world’s most powerful supercomputers—and the lab experts who operate them—to tackle today’s toughest manufacturing challenges, strengthen America’s manufacturing competitiveness, and move the country closer to an […]
$825M Extreme Ultraviolet Lithography R&D Facility to Be at Albany NanoTech Complex
October 31, 2024 by
The ongoing generative AI revolution as we know it would not be possible without EUV technology, which is used by TSMC, Samsung, Intel and other chip manufacturers to produce the most most advanced HPC-AI ….
Amkor and TSMC Collaborate on Advanced Packaging in Arizona
October 4, 2024 by
TEMPE, Ariz. and HSINCHU, Taiwan, R.O.C. Oct. 4, 2024 – TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract with Amkor’s outsourced semiconductor assembly and test (OSAT) services, in their planned facility in Peoria, Arizona. TSMC will leverage […]
HPC News Bytes 20240923 Podcast: Intel-Qualcomm, Responses to AI Energy Crisis, HPC-AI Beyond GPUs
September 23, 2024 by
A belated happy autumnal equinox to you! The white-water HPC-AI world produced major news over the past week, including: previously unthinkable Intel M&A reports, chips and software ….
HPC News Bytes 20240708: Low Yield Huawei AI Chip, AI ROI Questions, ASIC AI Chip
July 8, 2024 by
A good July morning to you! It was a short Fourth of July holiday week in the (U.S.) world of HPC-AI, here’s a rapid (6:04) run-down of news highlights: China’s SMIC wafer yields for Huawei AI chip yield to sanctions, Goldman joins generative AI ROI doubters, startup takes on Nvidia with special-purpose chip
D-Wave Extends Agreement with Aramco Europe to Explore Quantum-Powered Optimization of Geophysical Problems
June 6, 2024 by
PALO ALTO, Calif. – June 6, 2024 – D-Wave Quantum Inc. (NYSE: QBTS) announced today that it has extended its agreement with energy company Aramco to manage geophysical optimization problems through quantum technologies. Aramco Research Center in Delft, the Netherlands, is focused on developing advanced computing technologies to help address global energy challenges. For the […]
