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Radio Free HPC Recaps SC17 in Denver

In this podcast, the Radio Free HPC team describes the highlights of SC17 in Denver. Highlights includes the debute ARM hardware for HPC, a Rasberry Pie Cluster, and pervasive liquid cooling.

CoolIT Systems Showcases Liquid Cooling Innovations at SC17

CoolIT Systems is showcasing their innovative liquid cooling solutions at SC17 in Denver this week. “As the most popular integration partner for OEM server manufacturers, CoolIT will showcase liquid-enabled servers from Intel, Dell EMC, HPE, and Huawei. Combined with the broadest range of heat exchangers and supporting liquid infrastructure, CoolIT and their OEM partners are delivering the most complete and robust liquid cooling solutions to the HPC market.”

CoolIT Systems Unveils AHx2 Heat Exchange Module

Today CoolIT Systems announced their new AHx2 Heat Exchange Module. This compact Liquid-to-Air heat exchanger makes it possible for Direct Contact Liquid Cooling (DCLC) enabled servers to be thermally tested during the factory burn-in process, without additional liquid cooling infrastructure. 

CoolIT Systems AHx10 Heat Exchanger Delivers Rack Level Cooling without Facility Water

Today CoolIT Systems unveiled their new AHx10 Heat Exchange Module. This latest member of the CoolIT lineup is a rack mounted Liquid-to- Air heat exchanger that enables dramatic increases in server density without the need for any facility water. “Data centers struggling to manage the heat from high density racks now have a solution with the AHx10 that requires no facility modification,” said CoolIT Systems VP of Product Marketing, Pat McGinn. “The plug and play characteristics of the AHx10 make it a high flexible, simple to install solution that delivers the great benefits of liquid cooling immediately.”

Asetek Partners with E4 Computer Engineering, Announces Installation at CINECA

Today Asetek announced E4 Computer Engineering as a new datacenter OEM partner. E4 Computer Engineering has utilized Asetek RackCDU D2C (Direct-to-Chip) liquid cooling for the D.A.V.I.D.E. SUPERCOMPUTER in Italy. Commissioned by PRACE (The Partnership for Advanced Computing in Europe) and installed at CINECA (PRACE Italian hosting member), the innovative OpenPOWER-based D.A.V.I.D.E. supercomputer is built on top of the IBM POWER8 architecture.

Asetek Announces NEC as New Datacenter OEM Partner

Today Asetek announced NEC Corporation as a new data center OEM partner. NEC Corporation, through its subsidiary NEC Fielding, Ltd., will deploy Asetek RackCDU Direct-to-Chip liquid cooling at a new HPC installation in Japan. Asetek has already begun to make shipments in support of this installation. “Liquid cooling technology is becoming a key supercomputer component. Asetek’s direct-to-chip technology enables more effective cooling and increased computational performance in high density HPC clusters, adding value for our end-users,” said Noritaka HOSHI, (Senior Manager), NEC Corporation.

The Inflection Point of Wattage in HPC, Deep Learning and AI

Magnified in 2017 by machine learning and AI, there is a heightened concern in the HPC community over wattage trends in CPUs, GPUs and emerging neural chips required to meet accelerating computational demands in HPC clusters. In this sponsored post from Asetek, the company examines how high wattage trends in HPC, deep learning and AI might be reaching an inflection point.

JPCU Deploys Immersion-cooled Supercomputer

Today Green Revolution Cooling announced the latest installation of its liquid immersion computing system at John Paul Catholic University (JPCU) in San Diego. The high density cluster made up of industry standard servers optimized for immersion, and built in partnership with Supermicro, exploit the enhanced performance and compelling economic value inherent with GRC liquid immersion technology. “Virtually limitless cooling, industry leading efficiency, and lower upfront cost, made it an absolute no brainer for us,” said Kevin Meziere, VP of Technology at JPCU “the ability to cool over 100kW [per rack] effectively and efficiently, gives us the ability to be more responsive to future technology trends and adopt more powerful hardware without concerns of cooling capacity and costs. Being a downtown campus every square inch counts, so the ability more densely pack equipment is a huge win.”

Purdue Develops Intrachip Micro-cooling for HPC

“I think for the first time we have shown a proof of concept for embedded cooling for Department of Defense and potential commercial applications,” Garimella said. “This transformative approach has great promise for use in radar electronics, as well as in high-performance supercomputers. In this paper, we have demonstrated the technology and the unprecedented performance it provides.”

Fujitsu Deploys immersion-cooled x86 Cluster for JARI in Japan

Today Fujitsu announced the deployment of a immersion-cooled cluster at the Japan Automobile Research Institute (JARI). The new system will be used simulate automobile collisions. “Going forward, Fujitsu has plans to offer the liquid immersion cooling system worldwide as a product for cooling IT devices in non-conductive fluid.”