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CPC Enhances Non-spill Quick Disconnects for Liquid Cooled HPC

As liquid cooling becomes more and more pervasive in HPC datacenters, the mitigation of leaks and spills is a growing concern. Enter CPC, a maker of quick disconnects (QDs) designed specifically for liquid cooling use. Today CPC announced its LQ Series of connectors with more robust non-spill connectors for high-performance computing and data center applications.

Asetek lands new OEM, Channel Partner, and HPC Installation

Today Asetek announced an order from a new channel partner to service demand from a new OEM customer for an undisclosed HPC installation. All parties remain undisclosed at this time. “Adding OEMs has been a key goal for our datacenter business and it is particularly satisfying to add another significant OEM to our portfolio of customers,” said André Sloth Eriksen, CEO and founder of Asetek. “This order confirms our ability to leverage our leading position in the HPC segment to attract new customers as well as end-users.”

Canada’s Biggest Radio Telescope to use CoolIT Systems Liquid Cooling

With support from CoolIT Systems with a custom Direct Liquid Cooling solution, the CHIME telescope will map out the entire northern sky each day, aiming to constrain the properties and evolution of Dark Energy over a broad swath of cosmic history. “The liquid cooled system consists of 256 rack-mounted General Technics GT0180 custom 4u servers housed in 26 racks managed by CoolIT Systems Rack DCLC CHx40 Heat Exchange Modules. The custom direct contact cooling loops manage 100% of heat generated by the single Intel Xeon E5 2620v3 CPUs and the Dual AMD FirePro S9300x2 GPUs, while simultaneously pulling heat from the ambient air into the liquid coolant loops.”

What Lies Ahead for HPC Cooling?

“To meet the ambitious targets for exascale computing, many cooling companies are exploring optimizations and innovative methods that will redefine cooling architectures for the next generation of HPC systems. Here, some of the prominent cooling technology providers give their views on the current state and future prospects of cooling technology in HPC.”

Asperitas and Qarnot Collaborate in Liquid Cooling

Today Dutch cleantech company Asperitas and French green HPC service provider Qarnot announced a partnership centered around liquid cooling for datacenters. Qarnot will act as a value added reseller and operator of the Immersed Computing solution AIC24 developed by Asperitas. The AIC24 is a stand-alone plug and play solution to facilitate IT in a very energy efficient and reliable way making use of total liquid cooling. Qarnot and Asperitas are planning to deploy a showcase at the HQ of Qarnot in Paris.

DOE Labs Adopt Asetek Liquid Cooling

Today Asetek announced two incremental orders from Penguin Computing, an established data center OEM. The orders are for Asetek’s RackCDU D2C™ (Direct-to-Chip) liquid cooling solution and will enable increased computing power for two currently undisclosed HPC sites at U.S. Department of Energy (DOE) National Laboratories.

Intel’s Xeon Scalable Processors Provide Cooling Challenges for HPC

Unless you reduce node and rack density, the wattages of today’s high-poweredCPUs and GPUs are simply no longer addressable with air cooling alone. Asetek explores how new processors, such as Intel’s Xeon Scalable processors, often call for more than just air cooling. “The largest Xeon Phi direct-to-chip cooled system today is Oakforest-PACS system in Japan. The system is made up of 8,208 computational nodes using Asetek Direct-to-Chip liquid cooled Intel Xeon Phi high performance processors with Knights Landing architecture. It is the highest performing system in Japan and #7 on the Top500.”

Asetek Announces Regional OEM HPC installation

Today Asetek announced an order from a new European OEM customer to service demand for an HPC (High Performance Computing) installation. “The order is for Asetek’s RackCDU D2C (Direct-to-Chip) liquid cooling solution and is valued at $32,000 USD with delivery scheduled for Q3 2017.”

Is Water-Free Cooling the Real Future of HPC?

In this video from ISC 2017, Olivier de Laet from Calyos describes the company’s innovative cooling technology for high performance computing. “The HPC industry is ever facing is facing the challenge of ever-increasing cooling requirements. While liquid cooling cooling looks to be the best solution, what if you could achieve the same efficiencies without out using water and pumps?”

Liquid Cooling for HPC Gains Momentum with Asetek at ISC 2017

“Liquid cooling is becoming the new norm in the face of skyrocketing wattages by CPUs, GPUs and cluster nodes. Asetek cooling solutions are currently provided by OEMs such as Cray, Fujitsu, Format, Penguin. Liquid cooling for NVIDIA P100, Intel Knight’s Landing and Skylake were all on display at Asetek’s booth as well as rack-level options such as InRackCDU and Vertical RackCDU.”