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Schneider Electric teams with Iceotope for Liquid-Cooled Datacenters

Today Schneider Electric announced it is teaming up with Avnet and Iceotope to jointly develop innovative, chassis-level immersive liquid cooling solutions for data centers. This newly announced partnership brings together three global technology innovation leaders: Avnet for technology integration services; Iceotope for chassis-level immersion cooling technologies; and Schneider Electric for data center infrastructure solutions. “The development of a liquid cooling technology solution offers customers the performance needed to deliver on these growing compute demands.”

Immersive Cooling from Submer Technologies coming to EU Joint Research Center in Italy

In a collaborative effort with Airbus, Submer Technologies and 2CRSi are providing supercomputer-speed processing in high-density clusters to support real-time workloads for advanced Artificial Intelligence (AR) cybersecurity research applications at the JRC campus. “This is one of our most important installations yet. It’s a mission-critical, high-density compute environment where physical space and energy compliance are important considerations,” said Daniel Pope, CEO of Submer. “We designed the SmartPod to address all of these issues – making this project a perfect use-case for our liquid immersion cooling platform.”

New Liquid Cooled AMD EPYC 7H12 Processor Breaks Performance Records

Today AMD announced a new addition to the 2nd Generation AMD EPYC family, the AMD EPYC 7H12 processor. The 64 core/128 thread, 2.6Ghz base frequency, 3.3Ghz max boost frequency, 280W TDP processor is specifically built for HPC customers and workloads, using liquid cooling to deliver leadership supercomputing performance. “In an ATOS testing on their BullSequana XH2000, the new AMD EPYC 7H12 processor has set four new world-records in server performance. With a LINPACK score of ~ 4.2 TeraFLOPS, the new chip performs ~11% better than the AMD EPYC 7742 processor.”

Thermoplastic Connectors Grow in Popularity Along with Liquid Cooling

As liquid cooling becomes more and more prevalent, new technology and types of connectors are becoming water cooler topics for those in the data and computing industries. According to a new report from CPC, long-term, leak-free performance in fluid management systems requires robust connectors. And advanced materials are growing the range of available QD options.

Metal or Plastic Quick Disconnects? Key Considerations

Long-term, leak-free performance in fluid management systems requires robust connectors. As liquid cooling is increasingly deployed in high performance computing and data center applications, these industries demand quick disconnects (QDs) purpose-built for their needs. Gone are the days of making do with metal ball-and-sleeve connectors designed for heavy industrial use. Download the new guide from CPC that outlines key performance factors of new PPSU QDs compared to traditional all-metal QDs for liquid cooling.

Cooling Challenges for Ultra-high Density Compute Clusters

Miguel Terol from Lenovo gave this talk at HPCKP’19. “Technology players are refining their chip and platform designs to enable much denser systems. The trade-off of this trend is chips are getting more and more power hungry, and cooling those components becomes a challenge in terms of sustainability, either for the environment or the economy. In this talk we will present the high density technology landscape and different approaches to address the cooling challenges.”

GRC Launches Immersion Cooled Micro-Modular Data Center Solution

Today GRC announced the launch of a new micro-modular data center solution, the ICEraQ Micro, a rapidly deployable self-contained 24U server rack that can support up to 50kW of critical IT load and is nearly half the cost of other micro-modular solutions. “ICEraQ Micro gives IT professionals the freedom to easily add high-density computing, virtually anywhere.”

DUG Opens the Doors for 250 PF Bubba Supercomputer in Houston

Today DownUnder GeoSolutions (DUG) opened its giant new data center in Skybox Houston. Touted to be one of the most powerful supercomputers on earth, the facility is home to the company’s geophysical cloud service, DUG McCloud. “DUG is offering a unique cloud product including compute, storage, geophysical software, and services, initially with a massive 250 PF of geophysically-configured compute ready to go,” said DUG’s Managing Director, Dr Matthew Lamont.

CoolIT Systems Launches Liquid Cooling Solution for Intel Server System S9200WK

Today CoolIT Systems announced an integrated liquid cooling solution to support the Intel Server System S9200WK. “The Intel Server System S9200WK uses CoolIT’s innovative Rack DLC coldplate solution, featuring patented Split-Flow design. The liquid cooling solution for this 2U, four node server manages heat from the recently announced dual Intel Xeon Platinum 9200 processor CPUs, voltage regulators, and memory.”

DUG Installs Immersive Cooling for Bubba Supercomputer in Houston

Today DownUnder GeoSolutions (DUG) announced that tanks are arriving at Skybox Houston for “Bubba,” its huge geophysically-configured supercomputer. “DUG will cool the massive Houston supercomputer using their innovative immersion cooling system that has computer nodes fully submerged in specially-designed tanks filled with polyalphaolefin dielectric fluid. This month, the first of these 722 tanks have been arriving in shipping containers at the facility in Houston.”