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Asetek Announces Regional OEM HPC installation

Today Asetek announced an order from a new European OEM customer to service demand for an HPC (High Performance Computing) installation. “The order is for Asetek’s RackCDU D2C (Direct-to-Chip) liquid cooling solution and is valued at $32,000 USD with delivery scheduled for Q3 2017.”

Is Water-Free Cooling the Real Future of HPC?

In this video from ISC 2017, Olivier de Laet from Calyos describes the company’s innovative cooling technology for high performance computing. “The HPC industry is ever facing is facing the challenge of ever-increasing cooling requirements. While liquid cooling cooling looks to be the best solution, what if you could achieve the same efficiencies without out using water and pumps?”

Liquid Cooling for HPC Gains Momentum with Asetek at ISC 2017

“Liquid cooling is becoming the new norm in the face of skyrocketing wattages by CPUs, GPUs and cluster nodes. Asetek cooling solutions are currently provided by OEMs such as Cray, Fujitsu, Format, Penguin. Liquid cooling for NVIDIA P100, Intel Knight’s Landing and Skylake were all on display at Asetek’s booth as well as rack-level options such as InRackCDU and Vertical RackCDU.”

Penguin Computing doubles down on Asetek Liquid Cooling

Today Asetek announced an additional order from Penguin Computing for an undisclosed HPC installation. “This repeat order reflects our strong partnership with Penguin Computing. It is also another confirmation of the increasing need for liquid cooling in high density HPC clusters,” said André Sloth Eriksen, CEO and founder of Asetek.”

STULZ and CoolIT Systems Launch Liquid Cooled Micro Data Center for HPC

“The Micro DC is a compact data center that can be easily deployed in any environment while managing an incredible amount of power and performance,” said Joerg Desler, President of STULZ USA. “It’s modular system is configured to use various combinations of liquid and air cooling allowing the system to grow with the customer’s needs. Integrating STULZ technology with CoolIT Systems Rack DCLC has resulted in ultra-efficient total thermal solutions that can support any OEM server at even the highest density configurations.”

Increase in Wattage Trends Make Versatile Liquid Cooling the New Norm

Wattages are rising so high that to cool the nodes containing the highest performance chips used in HPC leaves one with little choice other than liquid cooling to maintain reasonable rack densities. Asetek explores how an increase in wattage trends is pushing the HPC industry toward more versatile liquid cooling options.

DataSite HPC Solution to use Motivair ChilledDoor Rack Systems

Today DataSite announced it will install Motivair Corporation’s ChilledDoor Rack Cooling system to accommodate a high performance computing environment for a strategic customer. “This initial engagement will officially launch an ongoing partnership between the two companies to deliver HPC services across DataSite’s facilities.We were eager to accommodate our customers’ desire to deploy HPC clusters in DataSite facilities, but did not want to sacrifice operational efficiencies,” comments Rob Wilson, Executive Vice President for DataSite. “After an extensive search of the HPC cooling market, Motivair was selected as the ideal product that provided industry best cooling capabilities while meeting DataSite’s Sustainability commitments.”

Peter Calverley Joins CoolIT Systems’ Board of Directors

Today CoolIT Systems announced that Peter Calverley, CFO of Tela Innovations, has been elected to CoolIT’s Board of Directors. Doug Reid has retired from the Board after 5 years of service. “I am excited to join the Board of Directors at CoolIT Systems – a company leading the industry with its innovative, energy efficient direct contact liquid cooling solutions,” said Peter Calverley. “I believe CoolIT’s unmatched technology presents an enormous opportunity to facilitate a step-change in data center computational capabilities.”

Asetek Lands Another RackCDU D2C Order for New HPC Installation

Today Asetek announced an order from one of its existing OEM partners for its RackCDU D2C (Direct-to-Chip) liquid cooling solution. The order is part of a new installation for an undisclosed HPC customer.

OCF in the UK Adopts Iceotope Liquid Cooling Technology

“Iceotope’s novel approach to liquid cooling allows us to deliver compute capability for customers with environments outside the traditional air cooled datacentre – for example a factory shop floor or an office environment where standard servers are too noisy,” said Steve Reynolds, sales director at OCF. “Our partnership with Iceotope enables us to provide an alternative and innovative solution for our customers.”