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Asetek Rides the Wave of Liquid Cooling for HPC at SC17

In this video from SC17 in Denver, Steve Branton from Asetek describes the company’s wide array of liquid cooling solutions for HPC. At the Asetek booth, the company displayed liquid cooling from recently announced OEMs and channel partners in addition to cooling solutions for the latest Intel, Nvidia and IBM CPUs, accelerators and GPUs. “We are seeing higher wattage HPC nodes that require liquid cooling as they cannot be cooled with air. Wattage density is only going to get higher with the inclusion of machine learning and AI across the HPC spectrum.”

GRC Builds GPU-Based Immersion Cluster for TACC

Green Revolution Cooling has announced plans to deliver a custom GPU-based cluster to the Texas Advanced Computing Center (TACC). Our goal is to make HPC more affordable. Offering lower cost, energy dense servers that take full advantage of our highly efficient CarnotJet cooling system is a huge benefit to our customers,” said Larry Stone, VP of Engineering at GRC “we are seeing a growing number of people opt for servers designed for immersion, over traditional big brand OEM hardware.”

CoolIT Systems Showcases OEM & Enterprise Data Center Liquid Cooling Solutions at SC17

In this video, Geoff Lyon from CoolIT Systems describes the company’s innovative liquid-cooling solutions for HPC. “Liquid cooling in the data center continues to grow in adoption and delivers more compelling ROIs. Our collaboration with OEM partners such as Dell EMC, HPE, Intel and STULZ provides further evidence that the future of the data center is destined for liquid cooling,” said Geoff Lyon, CEO and CTO at CoolIT Systems.

Radio Free HPC Recaps SC17 in Denver

In this podcast, the Radio Free HPC team describes the highlights of SC17 in Denver. Highlights includes the debut of ARM hardware for HPC, a Rasberry Pie Cluster, and pervasive liquid cooling.

CoolIT Systems Showcases Liquid Cooling Innovations at SC17

CoolIT Systems is showcasing their innovative liquid cooling solutions at SC17 in Denver this week. “As the most popular integration partner for OEM server manufacturers, CoolIT will showcase liquid-enabled servers from Intel, Dell EMC, HPE, and Huawei. Combined with the broadest range of heat exchangers and supporting liquid infrastructure, CoolIT and their OEM partners are delivering the most complete and robust liquid cooling solutions to the HPC market.”

CoolIT Systems Unveils AHx2 Heat Exchange Module

Today CoolIT Systems announced their new AHx2 Heat Exchange Module. This compact Liquid-to-Air heat exchanger makes it possible for Direct Contact Liquid Cooling (DCLC) enabled servers to be thermally tested during the factory burn-in process, without additional liquid cooling infrastructure. 

CoolIT Systems AHx10 Heat Exchanger Delivers Rack Level Cooling without Facility Water

Today CoolIT Systems unveiled their new AHx10 Heat Exchange Module. This latest member of the CoolIT lineup is a rack mounted Liquid-to- Air heat exchanger that enables dramatic increases in server density without the need for any facility water. “Data centers struggling to manage the heat from high density racks now have a solution with the AHx10 that requires no facility modification,” said CoolIT Systems VP of Product Marketing, Pat McGinn. “The plug and play characteristics of the AHx10 make it a high flexible, simple to install solution that delivers the great benefits of liquid cooling immediately.”

Asetek Partners with E4 Computer Engineering, Announces Installation at CINECA

Today Asetek announced E4 Computer Engineering as a new datacenter OEM partner. E4 Computer Engineering has utilized Asetek RackCDU D2C (Direct-to-Chip) liquid cooling for the D.A.V.I.D.E. SUPERCOMPUTER in Italy. Commissioned by PRACE (The Partnership for Advanced Computing in Europe) and installed at CINECA (PRACE Italian hosting member), the innovative OpenPOWER-based D.A.V.I.D.E. supercomputer is built on top of the IBM POWER8 architecture.

Asetek Announces NEC as New Datacenter OEM Partner

Today Asetek announced NEC Corporation as a new data center OEM partner. NEC Corporation, through its subsidiary NEC Fielding, Ltd., will deploy Asetek RackCDU Direct-to-Chip liquid cooling at a new HPC installation in Japan. Asetek has already begun to make shipments in support of this installation. “Liquid cooling technology is becoming a key supercomputer component. Asetek’s direct-to-chip technology enables more effective cooling and increased computational performance in high density HPC clusters, adding value for our end-users,” said Noritaka HOSHI, (Senior Manager), NEC Corporation.

The Inflection Point of Wattage in HPC, Deep Learning and AI

Magnified in 2017 by machine learning and AI, there is a heightened concern in the HPC community over wattage trends in CPUs, GPUs and emerging neural chips required to meet accelerating computational demands in HPC clusters. In this sponsored post from Asetek, the company examines how high wattage trends in HPC, deep learning and AI might be reaching an inflection point.